Issued Patents 2024
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12156376 | Two-phase immersion-type heat dissipation structure having porous structure | CHING-MING YANG, Chun-Te Wu | 2024-11-26 |
| 12140386 | Heat-dissipating substrate structure | CHING-MING YANG | 2024-11-12 |
| 12120845 | Liquid-cooling heat dissipation plate with unequal height pin-fins and enclosed liquid-cooling cooler having the same | Yi-Hsin Huang, Chun-Lung Wu, Kuo-Wei Lee | 2024-10-15 |
| 12108574 | Two-phase immersion-type heat dissipation structure having fins for facilitating bubble generation | Chun-Te Wu, CHING-MING YANG, Yu-Wei Chiu | 2024-10-01 |
| 12092406 | Two-phase immersion-type heat dissipation structure having non-vertical fins | CHING-MING YANG, Chun-Te Wu | 2024-09-17 |
| 12048119 | Immersion-type liquid cooling heat dissipation sink | Chi-An Chen | 2024-07-23 |
| 11988467 | Liquid-cooling heat dissipation plate with pin-fins and enclosed liquid cooler having the same | CHING-MING YANG, Chun-Lung Wu | 2024-05-21 |
| 11895778 | Etching method for manufacturing substrate structure having thick electrically conductive layer, and substrate structure having thick electrically conductive layer | SHIH-HSI TAI, Tung-Ho Tao | 2024-02-06 |