Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11895778 | Etching method for manufacturing substrate structure having thick electrically conductive layer, and substrate structure having thick electrically conductive layer | Tung-Ho Tao, TZE-YANG YEH | 2024-02-06 |