Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11942406 | Semiconductor packages with embedded interconnects | Kyu Oh Lee, Dilan Seneviratne | 2024-03-26 |
| 11935857 | Surface finishes with low RBTV for fine and mixed bump pitch architectures | Kristof Darmawaikarta, Robert Alan May, Sashi S. Kandanur, Sri Ranga Sai Boyapati, Srinivas V. Pietambaram +7 more | 2024-03-19 |