Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12132002 | Bridge interconnection with layered interconnect structures | Yueli Liu, Qinglei Zhang, Rui Zhang | 2024-10-29 |
| 12062551 | High density organic interconnect structures | Sri Chaitra Jyotsna Chavali, Siddharth K. Alur, Lilia May | 2024-08-13 |