Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12051692 | Integrated circuit structure with front side signal lines and backside power delivery | Quan Shi, Marni Nabors, Nikolay RYZHENKO, Xinning Wang, Sivakumar Venkataraman | 2024-07-30 |
| 11948874 | Vertically spaced intra-level interconnect line metallization for integrated circuit devices | Kevin Lin, Patrick Morrow, Richard E. Schenker, Mauro J. Kobrinsky | 2024-04-02 |