Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12100705 | Deep trench via for three-dimensional integrated circuit | Yih Wang, Rishabh Mehandru, Mauro J. Kobrinsky, Tahir Ghani, Mark Bohr | 2024-09-24 |
| 12051692 | Integrated circuit structure with front side signal lines and backside power delivery | Quan Shi, Sukru YEMENICIOGLU, Nikolay RYZHENKO, Xinning Wang, Sivakumar Venkataraman | 2024-07-30 |
| 11881452 | Device layer interconnects | Mark Bohr, Mauro J. Kobrinsky | 2024-01-23 |