Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11894359 | Distributed semiconductor die and package architecture | Wilfred Gomes, Mark Bohr, Rajesh Kumar, Robert L. Sankman, Ravindranath V. Mahajan | 2024-02-06 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11894359 | Distributed semiconductor die and package architecture | Wilfred Gomes, Mark Bohr, Rajesh Kumar, Robert L. Sankman, Ravindranath V. Mahajan | 2024-02-06 |