Issued Patents 2024
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183649 | IC package including multi-chip unit with bonded integrated heat spreader | Debendra Mallik, Digvijay A. Raorane | 2024-12-31 |
| 12181710 | Photonic integrated circuit packaging architecture | Omkar G. Karhade, Xiaoqian Li, Tarek A. Ibrahim, Nitin A. Deshpande | 2024-12-31 |
| 12159813 | Embedded bridge die with through-silicon vias | Aditya S. Vaidya, Digvijay A. Raorane, Paul R. Start | 2024-12-03 |
| 12148742 | Active bridge enabled co-packaged photonic transceiver | Thomas Liljeberg, Andrew C. Alduino, Ling Liao, Kenneth M. Brown, James E. Jaussi +2 more | 2024-11-19 |
| 12142545 | Nested architectures for enhanced heterogeneous integration | Debendra Mallik, Sujit Sharan, Digvijay A. Raorane | 2024-11-12 |
| 12142568 | Multi-die ultrafine pitch patch architecture of interconnect bridge over glass layer and method of making | Sanka Ganesan, Kevin Thomas McCarthy, Leigh M. TRIBOLET, Debendra Mallik, Robert L. Sankman | 2024-11-12 |
| 12074102 | Structural elements for application specific electronic device packages | Suddhasattwa Nad, Brandon C. Marin, Jeremy Ecton, Mohammad Mamunur Rahman | 2024-08-27 |
| 12061371 | Patch on interposer architecture for low cost optical co-packaging | Xiaoqian Li, Nitin A. Deshpande, Omkar G. Karhade | 2024-08-13 |
| 12048123 | Heat dissipation device having shielding/containment extensions | Aastha Uppal, Je-Young Chang | 2024-07-23 |
| 11901299 | Interconnect architecture with silicon interposer and EMIB | MD Altaf Hossain, Ankireddy Nalamalpu, Dheeraj Subbareddy, Robert Sankman, Debendra Mallik +7 more | 2024-02-13 |
| 11894359 | Distributed semiconductor die and package architecture | Wilfred Gomes, Mark Bohr, Rajesh Kumar, Robert L. Sankman, Wesley McCullough | 2024-02-06 |