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Metal-free frame design for silicon bridges for semiconductor packages |
Dae-Woo Kim, Sairam Agraharam |
2024-12-17 |
| 12142553 |
Guard ring design enabling in-line testing of silicon bridges for semiconductor packages |
Arnab Sarkar, Dae-Woo Kim |
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| 12142545 |
Nested architectures for enhanced heterogeneous integration |
Ravindranath V. Mahajan, Debendra Mallik, Digvijay A. Raorane |
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| 12113026 |
Multi-chip package and method of providing die-to-die interconnects in same |
Henning Braunisch, Chia-Pin Chiu, Aleksandar Aleksov, Hinmeng Au, Stefanie M. Lotz +1 more |
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| 12074121 |
Metal-free frame design for silicon bridges for semiconductor packages |
Dae-Woo Kim, Sairam Agraharam |
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| 12057413 |
Package design scheme for enabling high-speed low-loss signaling and mitigation of manufacturing risk and cost |
Lijiang Wang, Jianyong Xie, Arghya Sain, Xiaohong Jiang, Kemal Aygun |
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| 12046568 |
Capacitor die embedded in package substrate for providing capacitance to surface mounted die |
Andrew Collins, Jianyong Xie |
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| 12044888 |
Silicon groove architectures and manufacturing processes for passive alignment in a photonics die |
Omkar G. Karhade, Xiaoqian Li, Nitin A. Deshpande |
2024-07-23 |
| 11876053 |
Multi-chip package and method of providing die-to-die interconnects in same |
Henning Braunisch, Chia-Pin Chiu, Aleksandar Aleksov, Hinmeng Au, Stefanie M. Lotz +1 more |
2024-01-16 |