Issued Patents 2024
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12181710 | Photonic integrated circuit packaging architecture | Omkar G. Karhade, Tarek A. Ibrahim, Ravindranath V. Mahajan, Nitin A. Deshpande | 2024-12-31 |
| 12174436 | Package expanded beam connector for on-package optics | Wesley B. Morgan, Srikant Nekkanty, Todd Coons, Gregorio R. Murtagian, Nitin A. Deshpande +1 more | 2024-12-24 |
| 12158625 | Bidirectional optical grating coupler with multiple light paths for testing photonics devices | Kaveh Hosseini, Conor O'Keeffe, Jing Fang, Kevin P. MA, Shamsul Abedin | 2024-12-03 |
| 12148744 | Optical multichip package with multiple system-on-chip dies | Zhichao Zhang, Kemal Aygun, Suresh Pothukuchi, Omkar G. Karhade | 2024-11-19 |
| D1043096 | Umbrella base | — | 2024-09-24 |
| 12099245 | Completely encapsulated optical multi chip package | Asako Toda, Chia-Pin Chiu, Yiqun Bai | 2024-09-24 |
| 12061371 | Patch on interposer architecture for low cost optical co-packaging | Nitin A. Deshpande, Omkar G. Karhade, Ravindranath V. Mahajan | 2024-08-13 |
| 12044888 | Silicon groove architectures and manufacturing processes for passive alignment in a photonics die | Omkar G. Karhade, Nitin A. Deshpande, Sujit Sharan | 2024-07-23 |
| 12003023 | In-package 3D antenna | Zhenguo Jiang, Omkar G. Karhade, Srichaitra Chavali, Zhichao Zhang, Jimin Yao +2 more | 2024-06-04 |