Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12062616 | Power delivery for embedded bridge die utilizing trench structures | Kemal Aygun, Zhiguo Qian | 2024-08-13 |
| 12057413 | Package design scheme for enabling high-speed low-loss signaling and mitigation of manufacturing risk and cost | Lijiang Wang, Arghya Sain, Xiaohong Jiang, Sujit Sharan, Kemal Aygun | 2024-08-06 |
| 12046568 | Capacitor die embedded in package substrate for providing capacitance to surface mounted die | Andrew Collins, Sujit Sharan | 2024-07-23 |
| 11887932 | Dielectric-filled trench isolation of vias | Kemal Aygun, Zhiguo Qian | 2024-01-30 |