Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11915996 | Microelectronics assembly including top and bottom packages in stacked configuration with shared cooling | MD Altaf Hossain, Ankireddy Nalamalpu, Dheeraj Subbareddy | 2024-02-27 | $28,450,000 |
| 11901299 | Interconnect architecture with silicon interposer and EMIB | MD Altaf Hossain, Ankireddy Nalamalpu, Dheeraj Subbareddy, Ravindranath V. Mahajan, Debendra Mallik +7 more | 2024-02-13 | $18,546,000 |