Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12142568 | Multi-die ultrafine pitch patch architecture of interconnect bridge over glass layer and method of making | Sanka Ganesan, Leigh M. TRIBOLET, Debendra Mallik, Ravindranath V. Mahajan, Robert L. Sankman | 2024-11-12 |