Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12159825 | Dielectric-to-metal adhesion promotion material | Rahul N. Manepalli, Suddhasattwa Nad, Darko Grujicic | 2024-12-03 |
| 12057252 | Electronic substrates having embedded inductors | Benjamin Duong, Michael Garelick, Darko Grujicic, Tarek A. Ibrahim, Brandon C. Marin +1 more | 2024-08-06 |
| 12033930 | Selectively roughened copper architectures for low insertion loss conductive features | Jieying Kong, Yiyang Zhou, Suddhasattwa Nad, Jeremy Ecton, Hongxia Feng +9 more | 2024-07-09 |