Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12159840 | Scalable and interoperable PHYLESS die-to-die IO solution | Zhiguo Qian, Gerald Pasdast, Juan Zeng, Ahmad Siddiqui, Lakshmipriya Seshan | 2024-12-03 |
| 12152120 | Cellulose foams for high-performance insulation | Xiao Zhang, Aboutaleb Ameli | 2024-11-26 |
| 12100662 | Power-forwarding bridge for inter-chip data signal transfer | Zhiguo Qian, Gerald Pasdast, Daniel Scott Krueger, Edward A. Burton | 2024-09-24 |