Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12068222 | Dummy die structures of a packaged integrated circuit device | Mitul Modi, Joseph Van Nausdle, Omkar G. Karhade, Edvin Cetegen, Nicholas S. Haehn +4 more | 2024-08-20 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12068222 | Dummy die structures of a packaged integrated circuit device | Mitul Modi, Joseph Van Nausdle, Omkar G. Karhade, Edvin Cetegen, Nicholas S. Haehn +4 more | 2024-08-20 |