Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12060485 | Low gloss non-coating thermoplastic resin composition, method for manufacturing molded article by using the same, and molded article manufactured through the same | Seul Yi, Boo Youn An, Dae-sik Kim, Kyeong Hoon Jang, Min-Woo Kwon +8 more | 2024-08-13 |
| 11955448 | Architecture to manage FLI bump height delta and reliability needs for mixed EMIB pitches | Hongxia Feng, Xiaoying Guo, Rahul N. Manepalli | 2024-04-09 |
| 11935857 | Surface finishes with low RBTV for fine and mixed bump pitch architectures | Kristof Darmawaikarta, Robert Alan May, Sashi S. Kandanur, Sri Ranga Sai Boyapati, Srinivas V. Pietambaram +7 more | 2024-03-19 |
| 11923312 | Patternable die attach materials and processes for patterning | Bai Nie, Gang Duan, Srinivas V. Pietambaram, Jesse C. Jones, Yosuke Kanaoka +10 more | 2024-03-05 |