Issued Patents 2021
Showing 26–34 of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11037852 | 3DIC packaging with hot spot thermal management features | Wensen Hung, Szu-Po Huang, Hsiang-Fan Lee, Kim Hong Chen, Chi-Hsi Wu | 2021-06-15 |
| 11018081 | Heterogeneous fan-out structure and method of manufacture | Po-Hao Tsai, Po-Yao Chuang, Techi Wong | 2021-05-25 |
| 11011447 | Semiconductor package and method for forming the same | Chin-Hua Wang, Po-Yao Lin, Feng-Cheng Hsu, Wen-Yi Lin, Shu-Shen Yeh | 2021-05-18 |
| 11004741 | Profile of through via protrusion in 3DIC interconnect | Jiung Wu, Kuan-Liang Lai, Ming-Tsu Chung, Hong-Ye Shih, Ku-Feng Yang +3 more | 2021-05-11 |
| 11004771 | Cooling devices, packaged semiconductor devices, and methods of packaging semiconductor devices | Cheng-Chieh Hsieh, Chi-Hsi Wu, Tsung-Yu Chen, Wensen Hung | 2021-05-11 |
| 10985100 | Chip package with recessed interposer substrate | Po-Hao Tsai, Po-Yao Chuang, Feng-Cheng Hsu, Shuo-Mao Chen, Techi Wong | 2021-04-20 |
| 10971461 | Semiconductor device and method of manufacture | Po-Hao Tsai, Po-Yao Chuang, Ming-Chih Yew | 2021-04-06 |
| 10971483 | Semiconductor structure and manufacturing method thereof | Jui-Pin Hung, Feng-Cheng Hsu | 2021-04-06 |
| 10910267 | Alignment marks in substrate having through-substrate via (TSV) | Hsin Chang, Fang Wen Tsai, Jing-Cheng Lin, Wen-Chih Chiou | 2021-02-02 |