Issued Patents 2003
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6663787 | Use of ta/tan for preventing copper contamination of low-k dielectric layers | Christy Mei-Chu Woo, Pin-Chin Connie Wang | 2003-12-16 |
| 6653735 | CVD silicon carbide layer as a BARC and hard mask for gate patterning | Chih-Yuh Yang, Douglas J. Bonser, Pei-Yuan Gao | 2003-11-25 |
| 6638358 | Method and system for processing a semiconductor device | Mark S. Chang, Hao Fang | 2003-10-28 |
| 6635943 | Method and system for reducing charge gain and charge loss in interlayer dielectric formation | Angela T. Hui, Tuan Pham, Richard J. Huang, Mark T. Ramsbey | 2003-10-21 |
| 6632707 | Method for forming an interconnect structure using a CVD organic BARC to mitigate via poisoning | Fei Wang, Lynne A. Okada, Ramkumar Subramanian, James Kai, Calvin T. Gabriel | 2003-10-14 |
| 6627973 | Void-free interlayer dielectric (ILD0) for 0.18-micron flash memory semiconductor device | Minh Van Ngo, Robert A. Huertas, King Wai Kelwin Ko, Pei-Yuan Gao | 2003-09-30 |
| 6596631 | Method of forming copper interconnect capping layers with improved interface and adhesion | Minh Van Ngo, Hartmut Ruelke, Lothar Mergili, Joerg Hohage, Robert A. Huertas +1 more | 2003-07-22 |
| 6586842 | Dual damascene integration scheme for preventing copper contamination of dielectric layer | Fei Wang, Christy Mei-Chu Woo | 2003-07-01 |
| 6577009 | Use of sic for preventing copper contamination of dielectric layer | Fei Wang, Minh Van Ngo | 2003-06-10 |
| 6576982 | Use of sion for preventing copper contamination of dielectric layer | Dawn Hopper, Minh Van Ngo | 2003-06-10 |
| 6576545 | Semiconductor devices with dual nature capping/ARC layers on fluorine doped silica glass inter-layer dielectrics and method of forming capping/ARC layers | Dawn Hopper, Minh Van Ngo | 2003-06-10 |
| 6573179 | Forming a strong interface between interconnect and encapsulation to minimize electromigration | Pin-Chin Connie Wang | 2003-06-03 |
| 6566283 | Silane treatment of low dielectric constant materials in semiconductor device manufacturing | Suzette K. Pangrle, Minh Van Ngo, Dawn Hopper | 2003-05-20 |
| 6530340 | Apparatus for manufacturing planar spin-on films | Dawn Hopper, Richard J. Huang | 2003-03-11 |
| 6518646 | Semiconductor device with variable composition low-k inter-layer dielectric and method of making | Dawn Hopper, Suzette K. Pangrle, Calvin T. Gabriel, Richard J. Huang | 2003-02-11 |
| 6518167 | Method of forming a metal or metal nitride interface layer between silicon nitride and copper | Matthew S. Buynoski, Paul R. Besser, Jeremias D. Romero, Pin-Chin Connie Wang, Minh Quoc Tran | 2003-02-11 |