Issued Patents 2003
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6660619 | Dual damascene metal interconnect structure with dielectric studs | Suzette K. Pangrle, Fei Wang | 2003-12-09 |
| 6656830 | Dual damascene with silicon carbide middle etch stop layer/ARC | Ramkumar Subramanian, Dawn Hopper, Fei Wang | 2003-12-02 |
| 6632707 | Method for forming an interconnect structure using a CVD organic BARC to mitigate via poisoning | Fei Wang, Ramkumar Subramanian, James Kai, Calvin T. Gabriel, Lu You | 2003-10-14 |
| 6610608 | Plasma etching using combination of CHF3 and CH3F | Fei Wang, Calvin T. Gabriel | 2003-08-26 |
| 6603206 | Slot via filled dual damascene interconnect structure without middle etch stop layer | Fei Wang, Ramkumar Subramanian, Calvin T. Gabriel | 2003-08-05 |
| 6599839 | Plasma etch process for nonhomogenous film | Calvin T. Gabriel, Dawn Hopper, Suzette K. Pangrle, Fei Wang | 2003-07-29 |
| 6583046 | Post-treatment of low-k dielectric for prevention of photoresist poisoning | Fei Wang, Calvin T. Gabriel | 2003-06-24 |
| 6534397 | Pre-treatment of low-k dielectric for prevention of photoresist poisoning | Fei Wang, Calvin T. Gabriel | 2003-03-18 |
| 6521524 | Via filled dual damascene structure with middle stop layer and method for making the same | Fei Wang, Ramkumar Subramanian, Calvin T. Gabriel | 2003-02-18 |
| 6514860 | Integration of organic fill for dual damascene process | Fei Wang, James Kai | 2003-02-04 |