Issued Patents 2003
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6670265 | Low K dielectic etch in high density plasma etcher | Fei Wang, Angela T. Hui | 2003-12-30 |
| 6632707 | Method for forming an interconnect structure using a CVD organic BARC to mitigate via poisoning | Fei Wang, Lynne A. Okada, Ramkumar Subramanian, Calvin T. Gabriel, Lu You | 2003-10-14 |
| 6554046 | Substrate cleaving tool and method | Michael A. Bryan | 2003-04-29 |
| 6513564 | Nozzle for cleaving substrates | Michael A. Bryan | 2003-02-04 |
| 6514860 | Integration of organic fill for dual damascene process | Lynne A. Okada, Fei Wang | 2003-02-04 |