Issued Patents 2003
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6596631 | Method of forming copper interconnect capping layers with improved interface and adhesion | Minh Van Ngo, Hartmut Ruelke, Joerg Hohage, Lu You, Robert A. Huertas +1 more | 2003-07-22 |