Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6596631 | Method of forming copper interconnect capping layers with improved interface and adhesion | Minh Van Ngo, Hartmut Ruelke, Lothar Mergili, Lu You, Robert A. Huertas +1 more | 2003-07-22 |
| 6569768 | Surface treatment and capping layer process for producing a copper interface in a semiconductor device | Hartmut Ruelke, Minh Van Ngo | 2003-05-27 |