Issued Patents 2003
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6599827 | Methods of forming capped copper interconnects with improved electromigration resistance | Minh Van Ngo, Steven C. Avanzino, Amit P. Marathe | 2003-07-29 |
| 6596631 | Method of forming copper interconnect capping layers with improved interface and adhesion | Minh Van Ngo, Lothar Mergili, Joerg Hohage, Lu You, Robert A. Huertas +1 more | 2003-07-22 |
| 6569768 | Surface treatment and capping layer process for producing a copper interface in a semiconductor device | Joerg Hohage, Minh Van Ngo | 2003-05-27 |
| 6506677 | Method of forming capped copper interconnects with reduced hillock formation and improved electromigration resistance | Steven C. Avanzino, Minh Van Ngo, Amit P. Marathe | 2003-01-14 |