Issued Patents 2003
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6661067 | Nitrogen-plasma treatment for reduced nickel silicide bridging | Minh Van Ngo, Christy Mei-Chu Woo, Paul R. Besser | 2003-12-09 |
| 6627973 | Void-free interlayer dielectric (ILD0) for 0.18-micron flash memory semiconductor device | Minh Van Ngo, Lu You, King Wai Kelwin Ko, Pei-Yuan Gao | 2003-09-30 |
| 6596631 | Method of forming copper interconnect capping layers with improved interface and adhesion | Minh Van Ngo, Hartmut Ruelke, Lothar Mergili, Joerg Hohage, Lu You +1 more | 2003-07-22 |
| 6562416 | Method of forming low resistance vias | Minh Van Ngo, Dawn Hopper | 2003-05-13 |
| 6528432 | H2-or H2/N2-plasma treatment to prevent organic ILD degradation | Minh Van Ngo, Dawn Hopper | 2003-03-04 |
| 6521529 | HDP treatment for reduced nickel silicide bridging | Minh Van Ngo, Christy Mei-Chu Woo, Ercan Adem | 2003-02-18 |