Issued Patents 2003
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6657303 | Integrated circuit with low solubility metal-conductor interconnect cap | Pin-Chin Connie Wang | 2003-12-02 |
| 6657304 | Conformal barrier liner in an integrated circuit interconnect | Christy Mei-Chu Woo, Minh Van Ngo, John Sanchez | 2003-12-02 |
| 6642145 | Method of manufacturing an integrated circuit with a dielectric diffusion barrier layer formed between interconnects and interlayer dielectric layers | Pin-Chin Connie Wang, Minh Van Ngo | 2003-11-04 |
| 6624642 | Metal bridging monitor for etch and CMP endpoint detection | Christopher F. Lyons, Ramkumar Subramanian | 2003-09-23 |
| 6599827 | Methods of forming capped copper interconnects with improved electromigration resistance | Minh Van Ngo, Amit P. Marathe, Hartmut Ruelke | 2003-07-29 |
| 6596637 | Chemically preventing Cu dendrite formation and growth by immersion | Diana M. Schonauer, Kai Yang | 2003-07-22 |
| 6593632 | Interconnect methodology employing a low dielectric constant etch stop layer | Minh Van Ngo, Angela T. Hui, Chun Jiang, Hamid Partovi | 2003-07-15 |
| 6562185 | Wafer based temperature sensors for characterizing chemical mechanical polishing processes | Bhanwar Singh, Bharath Rangarajan, Ramkumar Subramanian | 2003-05-13 |
| 6548336 | Planarization of a polysilicon layer surface by chemical mechanical polish to improve lithography and silicide formation | Steven K. Park | 2003-04-15 |
| 6530997 | Use of gaseous silicon hydrides as a reducing agent to remove re-sputtered silicon oxide | Larry Wang | 2003-03-11 |
| 6528409 | Interconnect structure formed in porous dielectric material with minimized degradation and electromigration | Sergey Lopatin, Fei Wang, Diana M. Schonauer | 2003-03-04 |
| 6525428 | Graded low-k middle-etch stop layer for dual-inlaid patterning | Minh Van Ngo, Christy Mei-Chu Woo, John Sanchez | 2003-02-25 |
| 6518185 | Integration scheme for non-feature-size dependent cu-alloy introduction | Pin-Chin Connie Wang, Fei Wang, Kashmir Sahota, Amit P. Marathe, Matthew S. Buynoski +2 more | 2003-02-11 |
| 6506677 | Method of forming capped copper interconnects with reduced hillock formation and improved electromigration resistance | Minh Van Ngo, Amit P. Marathe, Hartmut Ruelke | 2003-01-14 |
| 6503418 | Ta barrier slurry containing an organic additive | Kashmir Sahota, Diana M. Schonauer | 2003-01-07 |