Issued Patents 2003
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6664187 | Laser thermal annealing for Cu seedlayer enhancement | Minh Van Ngo | 2003-12-16 |
| 6649034 | Electro-chemical metal alloying for semiconductor manufacturing | Amit P. Marathe, Pin-Chin Connie Wang | 2003-11-18 |
| 6609946 | Method and system for polishing a semiconductor wafer | — | 2003-08-26 |
| 6589408 | Non-planar copper alloy target for plasma vapor deposition systems | Pin-Chin Connie Wang, Paul R. Besser, Sergey Lopatin | 2003-07-08 |
| 6583051 | Method of manufacturing an amorphized barrier layer for integrated circuit interconnects | Sergey Lopatin, Minh Van Ngo | 2003-06-24 |
| 6566248 | Graphoepitaxial conductor cores in integrated circuit interconnects | Pin-Chin Connie Wang | 2003-05-20 |
| 6541286 | Imaging of integrated circuit interconnects | Joffre F. Bernard | 2003-04-01 |
| 6518167 | Method of forming a metal or metal nitride interface layer between silicon nitride and copper | Lu You, Matthew S. Buynoski, Paul R. Besser, Jeremias D. Romero, Pin-Chin Connie Wang | 2003-02-11 |
| 6504251 | Heat/cold amorphized barrier layer for integrated circuit interconnects | Sergey Lopatin, Minh Van Ngo | 2003-01-07 |