Issued Patents 2003
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6630741 | Method of reducing electromigration by ordering zinc-doping in an electroplated copper-zinc interconnect and a semiconductor device thereby formed | Sergey Lopatin, Paul L. King | 2003-10-07 |
| 6624074 | Method of fabricating a semiconductor device by calcium doping a copper surface using a chemical solution | Sergey Lopatin, Paul L. King | 2003-09-23 |
| 6621165 | Semiconductor device fabricated by reducing carbon, sulphur, and oxygen impurities in a calcium-doped copper surface | Sergey Lopatin, Paul L. King | 2003-09-16 |
| 6541286 | Imaging of integrated circuit interconnects | Minh Quoc Tran | 2003-04-01 |
| 6541860 | Barrier-to-seed layer alloying in integrated circuit interconnects | Christy Mei-Chu Woo, Pin-Chin Connie Wang | 2003-04-01 |
| 6515367 | Sub-cap and method of manufacture therefor in integrated circuit capping layers | Minh Van Ngo, Tim Z. Hossain | 2003-02-04 |