Issued Patents All Time
Showing 101–125 of 155 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7207339 | Method for cleaning a plasma enhanced CVD chamber | Sheng-Wen Chen, Shiu-Ko JangJian, Hung Jui Chang | 2007-04-24 |
| 7205634 | MIM structure and fabrication process with improved capacitance reliability | Miao-Cheng Liao, Kuo-Hsien Cheng, Cheng-Chao Lin, Shao-Ta Hsu | 2007-04-17 |
| 7199045 | Metal-filled openings for submicron devices and methods of manufacture thereof | Chi-Wen Liu, Jung-Chih Tsao, Shih-Tzung Chang, Kei-Wei Chen | 2007-04-03 |
| 7144811 | Method of forming a protective layer over Cu filled semiconductor features | Chi-Wen Liu | 2006-12-05 |
| 7128821 | Electropolishing method for removing particles from wafer surface | Shih-Ho Lin, Chung-Chang Chen, Kei-Wei Chen, Shih-Tzung Chang, Chao-Lung Chen +2 more | 2006-10-31 |
| 7125802 | CMP process leaving no residual oxide layer or slurry particles | Shih-Chi Lin, Yi-Lung Cheng, Chi-Wen Liu, Ming-Hua Yoo, Wen-Kung Cheng +1 more | 2006-10-24 |
| 7078336 | Method and system for fabricating a copper barrier layer with low dielectric constant and leakage current | Yi-Lung Cheng | 2006-07-18 |
| 7071100 | Method of forming barrier layer with reduced resistivity and improved reliability in copper damascene process | Kei-Wei Chen, Jung-Chih Tsao, Chi-Wen Liu, Jchung-Chang Chen, Shih-Tzung Chang +2 more | 2006-07-04 |
| 7026233 | Method for reducing defects in post passivation interconnect process | Hsi-Kuei Cheng, Hung-Ju Chien, Hsun-Chang Chan, Chu-Chang Chen, Chin-Hao Su +2 more | 2006-04-11 |
| 6985222 | Chamber leakage detection by measurement of reflectivity of oxidized thin film | Hsi-Kuei Cheng, Chu-Chang Chen, Ting-Chun Wang, Szu-An Wu, Hsien-Ping Feng | 2006-01-10 |
| 6903011 | Displacement method to grow cu overburden | Chi-Wen Liu | 2005-06-07 |
| 6903019 | CMP process leaving no residual oxide layer or slurry particles | Shih-Chi Lin, Yi-Lung Cheng, Chi-Wen Liu, Ming-Hua Yoo, Wen-Kung Cheng +1 more | 2005-06-07 |
| 6863491 | Catch-pin water support for process chamber | Hsi-Kuei Cheng, Chun-Tse Lin, Ting-Chun Wang, Yu-Ku Lin | 2005-03-08 |
| 6828226 | Removal of SiON residue after CMP | Kei-Wei Chen, Kuo-Hsiu Wei, Yu-Kin Lin, Ting-Chun Wang, Shih-Tzung Chang | 2004-12-07 |
| 6825120 | Metal surface and film protection method to prolong Q-time after metal deposition | Chi-Wen Liu | 2004-11-30 |
| 6815007 | Method to solve IMD-FSG particle and increase Cp yield by using a new tougher UFUN season film | Ming-Hwa Yoo, Shih-Chi Lin, Yi-Lung Cheng, Szu-An Wu | 2004-11-09 |
| 6815072 | Method to solve particle performance of FSG layer by using UFU season film for FSG process | Ming-Hwa Yoo, Yi-Lung Cheng, Szu-An Wu | 2004-11-09 |
| 6802935 | Semiconductor chamber process apparatus and method | Yi-Lung Cheng, Hui-Chi Lin, Szu-An Wu | 2004-10-12 |
| 6790778 | Method for capping over a copper layer | Yi-Lung Cheng, We-Li Chen | 2004-09-14 |
| 6784077 | Shallow trench isolation process | Shih-Chi Lin, Chih-Chung Lee, Guey Bao Huang, Szu-An Wu, Chun-Chun Yeh | 2004-08-31 |
| 6776850 | Preventative maintenance aided tool for CVD chamber | Miao-Cheng Liao, Hung-Hsin Liang, Hsiang-Sheng Cheng, Sheng-Te Shu, Chih-Yuan Yang | 2004-08-17 |
| 6769959 | Method and system for slurry usage reduction in chemical mechanical polishing | Kei-Wei Chen, Ting-Chun Wang, Shih-Tzung Chang, Yu-Ku Lin, Ming-Wen Chen +1 more | 2004-08-03 |
| 6673661 | Self-aligned method for forming dual gate thin film transistor (TFT) device | Chi-Wen Liu, Ting-Chang Chang, Po-Tsun Liu | 2004-01-06 |
| 6670274 | Method of forming a copper damascene structure comprising a recessed copper-oxide-free initial copper structure | Chi-Wen Liu | 2003-12-30 |
| 6660638 | CMP process leaving no residual oxide layer or slurry particles | Shih-Chi Lin, Yi-Lung Cheng, Chi-Wen Liu, Ming-Hua Yoo, Wen-Kung Cheng +1 more | 2003-12-09 |