Issued Patents All Time
Showing 51–75 of 155 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9566683 | Method for wafer grinding | Kuo-Hsiu Wei, Kei-Wei Chen, Chun-Ting Kuo | 2017-02-14 |
| 9570311 | Modular grinding apparatuses and methods for wafer thinning | Chun-Ting Kuo, Kei-Wei Chen, Kuo-Hsiu Wei | 2017-02-14 |
| 9520477 | Semiconductor device and fabricating method thereof | Chi-Cheng Hung, Yu-Sheng Wang, Kei-Wei Chen | 2016-12-13 |
| 9502290 | Oxidation-free copper metallization process using in-situ baking | Yu-Sheng Wang, Shih-Ho Lin, Kei-Wei Chen, Szu-An Wu | 2016-11-22 |
| 9502647 | Resistive random-access memory (RRAM) with a low-K porous layer | Ting-Chang Chang, Kuan-Chang Chang, Tsung-Ming Tsai, Chih-Hung Pan, Kei-Wei Chen +2 more | 2016-11-22 |
| 9490345 | Semiconductor device and manufacturing method thereof | I-Chih Chen, Fu-Tsun Tsai, Yung-Fa Lee, Ko-Min Lin, Chih-Mu Huang | 2016-11-08 |
| 9419155 | Sensing product and method of making | Shih-Chieh Chang, Yu-Ku Lin | 2016-08-16 |
| 9379275 | Apparatus and method for reducing dark current in image sensors | Miao-Cheng Liao, Jinn-Kwei Liang, Wen-Chieh Hsieh, Shiu-Ko JangJian, Hsiang Hsiang Ko | 2016-06-28 |
| 9368394 | Dry etching gas and method of manufacturing semiconductor device | Yu-Li Hung, Te-Ming Kung, Chih-Hao Chen, Kei-Wei Chen, Hung Jui Chang +1 more | 2016-06-14 |
| 9356059 | BSI image sensor chips and methods for forming the same | Shiu-Ko JangJian, Kei-Wei Chen | 2016-05-31 |
| 9339912 | Wafer polishing tool using abrasive tape | Tang-Kuei Chang, Kuo-Hsiu Wei, Kei-Wei Chen, Wei-Jen Lo | 2016-05-17 |
| 9324863 | Semiconductor device | Wen-Chu Hsiao, Lai-Wan Chong, Chun-Chieh Wang, Ying-Min Chou, Hsiang Hsiang Ko | 2016-04-26 |
| 9281475 | Resistive random-access memory (RRAM) with multi-layer device structure | Ting-Chang Chang, Kuan-Chang Chang, Tsung-Ming Tsai, Chih-Hung Pan, Kei-Wei Chen +2 more | 2016-03-08 |
| 9254548 | Method of forming diamond conditioners for CMP process | Yen-Chang Chao, Kei-Wei Chen | 2016-02-09 |
| 9252180 | Bonding pad on a back side illuminated image sensor | Volume Chien, I-Chih Chen, Hsin-Chi Chen, Ying-Hao Chen, Hung-Ta Huang | 2016-02-02 |
| 9224773 | Metal shielding layer in backside illumination image sensor chips and methods for forming the same | Shih-Chieh Chang, Jian-Shin Tsai, Chih-Chang Huang, Ing-Ju Lee, Ching-Yao Sun +3 more | 2015-12-29 |
| 9224691 | Semiconductor device contact structures | Shih-Chieh Chang, Chih-Chung Chang, Kei-Wei Chen | 2015-12-29 |
| 9171759 | System and method for die to die stress improvement | Chia-Pin Cheng, Jung-Liang Chien, Chih-Kang Chao, Chi-Cherng Jeng, Hsin-Chi Chen | 2015-10-27 |
| 9120194 | Apparatus for wafer grinding | Kuo-Hsiu Wei, Kei-Wei Chen, Chun-Ting Kuo | 2015-09-01 |
| 9070664 | Device with MOS device including a secondary metal and PVD tool with target for making same | Shih-Chieh Chang, Kei-Wei Chen | 2015-06-30 |
| 9064770 | Methods for minimizing edge peeling in the manufacturing of BSI chips | Chun-Ting Kuo, Kei-Wei Chen, Kuo-Hsiu Wei | 2015-06-23 |
| 9064892 | Semiconductor devices utilizing partially doped stressor film portions and methods for forming the same | Wen-Chu Hsiao, Ju Wen Hsiao, Ying-Min Chou, Hsiang Hsiang Ko | 2015-06-23 |
| 9024369 | Metal shield structure and methods for BSI image sensors | Shiu-Ko JangJian, Chi-Cherng Jeng, Volume Chien | 2015-05-05 |
| 8890273 | Methods and apparatus for an improved reflectivity optical grid for image sensors | Shiu-Ko JangJian, Kei-Wei Chen | 2014-11-18 |
| 8891299 | MOSFET having memory characteristics | Ting-Chang Chang, Chih-Hao Dai, Fu-Yen Jian, Wen-Hung Lo, Shih-Chieh Chang | 2014-11-18 |