Issued Patents All Time
Showing 126–150 of 155 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6645825 | Planarization of shallow trench isolation (STI) | Chin Kun Lan, Ting-Chun Wang, Tong-Hua Kuan | 2003-11-11 |
| 6626741 | Method for improving thickness uniformity on a semiconductor wafer during chemical mechanical polishing | Ting-Chun Wang, Kei-Wei Chen, Shih-Tzung Chang, Yu-Ku Lin | 2003-09-30 |
| 6585826 | Semiconductor wafer cleaning method to remove residual contamination including metal nitride particles | Yali Tai, Shih-Chi Lin, Wen-Long Lee, Francis Wang, Szu-An Wu +1 more | 2003-07-01 |
| 6586347 | Method and structure to improve the reliability of multilayer structures of FSG (F-doped SiO2) dielectric layers and metal layers in semiconductor integrated circuits | Chung-Shi Liu, Hui Wang, Szu-An Wu, Chun-Ching Tsan, Tong-Hua Kuan | 2003-07-01 |
| 6558228 | Method of unloading substrates in chemical-mechanical polishing apparatus | Wen-Kung Cheng, Hung-Ju Chien, Jin C J Chen | 2003-05-06 |
| 6531382 | Use of a capping layer to reduce particle evolution during sputter pre-clean procedures | Tao Cheng, Wen-Hsin Huang, Jiun-Pyng You, Lin-June Wu, Shih-Tzung Chang +4 more | 2003-03-11 |
| 6514673 | Rule to determine CMP polish time | Hway-Chi Lin, Yu-Ku Lin, Wen-Pin Chang | 2003-02-04 |
| 6483892 | Volumetric computed tomography (CT) fluoroscopy system for small animal studies | Ying Liu | 2002-11-19 |
| 6479098 | Method to solve particle performance of FSG layer by using UFU season film for FSG process | Ming-Hwa Yoo, Yi-Lung Cheng, Szu-An Wu | 2002-11-12 |
| 6479881 | Low temperature process for forming intermetal gap-filling insulating layers in silicon wafer integrated circuitry | Chun-Ching Tsan, Jowei Dun, Hung-Ju Chien | 2002-11-12 |
| 6436791 | Method of manufacturing a very deep STI (shallow trench isolation) | Shih-Chi Lin, Szu-An Wu, Guey Bao Huang | 2002-08-20 |
| 6407007 | Method to solve the delamination of a silicon nitride layer from an underlying spin on glass layer | Chun-Ching Tsan, Hui Wang, Chin Kun Lan | 2002-06-18 |
| 6399522 | PE-silane oxide particle performance improvement | Chun-Ching Tsan, Hung-Ju Chien, Chun-Chang Chen | 2002-06-04 |
| 6395635 | Reduction of tungsten damascene residue | Jowei Dun | 2002-05-28 |
| 6372645 | Methods to reduce metal bridges and line shorts in integrated circuits | Chung-Shi Liu, Shau-Lin Shue, Chen-Hua Yu, Shih-Chi Lin, Ming-Jer Lee +1 more | 2002-04-16 |
| 6352924 | Rework method for wafers that trigger WCVD backside alarm | Jun Wu, Ming-Jer Lee, Yu-Ku Lin | 2002-03-05 |
| 6323141 | Method for forming anti-reflective coating layer with enhanced film thickness uniformity | Szu-Au Wu, Chun-Ching Tsan, Wen-Kung Cheng | 2001-11-27 |
| 6291872 | Three-dimensional type inductor for mixed mode radio frequency device | Hway-Chi Lin, Jun Wu, Jowei Dun | 2001-09-18 |
| 6291331 | Re-deposition high compressive stress PECVD oxide film after IMD CMP process to solve more than 5 metal stack via process IMD crack issue | Jowei Dun, Ming-Jer Lee, Tong-Hua Kuan | 2001-09-18 |
| 6287172 | Method for improvement of tungsten chemical-mechanical polishing process | Tong-Hua Kuan, Hui Wang, Chin Kun Lan | 2001-09-11 |
| 6281146 | Plasma enhanced chemical vapor deposition (PECVD) method for forming microelectronic layer with enhanced film thickness uniformity | Hui Wang, Jowei Dun, Szu-An Wu | 2001-08-28 |
| 6268274 | Low temperature process for forming inter-metal gap-filling insulating layers in silicon wafer integrated circuitry | Chun-Ching Tsan, Jowei Dun, Hung-Ju Chien | 2001-07-31 |
| 6248002 | Obtaining the better defect performance of the fuse CMP process by adding slurry polish on more soft pad after slurry polish | Hui Wang, Tong-Hua Kuan, Yu-Ku Lin | 2001-06-19 |
| 6232043 | Rule to determine CMP polish time | Hway-Chi Lin, Yu-Ku Lin, Wen-Pin Chang | 2001-05-15 |
| 6174454 | Slurry formulation for selective CMP of organic spin-on-glass insulating layer with low dielectric constant | Ming-Shih Tsai, Shih-Tzung Chang, Bau-Tong Dai | 2001-01-16 |