Issued Patents All Time
Showing 51–75 of 136 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11270976 | Package structure and method of manufacturing the same | Shu-Hang Liao, Chih-Wei Wu, Jing-Cheng Lin, Szu-Wei Lu | 2022-03-08 |
| 11257715 | Integrated fan-out packages and methods of forming the same | Chih-Wei Wu, Szu-Wei Lu, Jing-Cheng Lin, Long Hua Lee | 2022-02-22 |
| 11205615 | Semiconductor device and method of manufacture | Hsien-Ju Tsou, Chih-Wei Wu, Jing-Cheng Lin, Pu Wang, Szu-Wei Lu | 2021-12-21 |
| 11201097 | Method of manufacture of a semiconductor device | Kuan-Yu Huang, Chih-Wei Wu, Li-Chung Kuo, Long Hua Lee, Sung-Hui Huang +1 more | 2021-12-14 |
| 11183482 | Shift control method in manufacture of semiconductor device | Chih-Wei Wu, Hsien-Ju Tsou | 2021-11-23 |
| 11164855 | Package structure with a heat dissipating element and method of manufacturing the same | Weiming Chris Chen, Chi-Hsi Wu, Chih-Wei Wu, Kuo-Chiang Ting, Szu-Wei Lu +3 more | 2021-11-02 |
| 11164824 | Package structure and method of fabricating the same | Tsung-Fu Tsai, Kung-Chen Yeh, Li-Chung Kuo, Szu-Wei Lu | 2021-11-02 |
| 11152330 | Semiconductor package structure and method for forming the same | Cheng-Chieh Li, Pu Wang, Chih-Wei Wu, Szu-Wei Lu | 2021-10-19 |
| 11145562 | Package structure and method of manufacturing the same | Jung-Hua Chang, Chih-Wei Wu, Szu-Wei Lu | 2021-10-12 |
| 11139260 | Plurality of stacked pillar portions on a semiconductor structure | Jung-Hua Chang, Szu-Wei Lu | 2021-10-05 |
| 11139285 | Semiconductor package | Hsien-Ju Tsou, Chih-Wei Wu, Pu Wang, Szu-Wei Lu, Jing-Cheng Lin | 2021-10-05 |
| 11133286 | Chip packages and methods of manufacture thereof | Chih-Wei Wu, Jing-Cheng Lin, Szu-Wei Lu | 2021-09-28 |
| 11133289 | Semiconductor package and manufacturing method of semiconductor package having plurality of encapsulating materials | Tsung-Fu Tsai, Shih-Ting Lin, Szu-Wei Lu | 2021-09-28 |
| 11121050 | Method of manufacture of a semiconductor device | Kuan-Yu Huang, Chih-Wei Wu, Li-Chung Kuo, Long Hua Lee, Sung-Hui Huang +1 more | 2021-09-14 |
| 11101260 | Method of forming a dummy die of an integrated circuit having an embedded annular structure | Shang-Yun Hou, Sung-Hui Huang, Kuan-Yu Huang, Hsien-Pin Hu, Yushun Lin +8 more | 2021-08-24 |
| 11094639 | Semiconductor package | Jing-Cheng Lin, Po-Hao Tsai, Szu-Wei Lu | 2021-08-17 |
| 11088086 | Chip package structure and method for forming the same | Jiun-Ting Chen, Szu-Wei Lu, Chih-Wei Wu | 2021-08-10 |
| 11075133 | Underfill structure for semiconductor packages and methods of forming the same | Yu-Wei Chen, Li-Chung Kuo, Szu-Wei Lu, Jing-Cheng Lin, Long Hua Lee +1 more | 2021-07-27 |
| 11024616 | Package structure and method of manufacturing the same | Yu-Wei Chen, Li-Chung Kuo, Long Hua Lee, Szu-Wei Lu, Kuan-Yu Huang | 2021-06-01 |
| 10964673 | Semiconductor device and manufacturing method of the same | Jing-Cheng Lin, Pu Wang, Chen-Hua Yu | 2021-03-30 |
| 10916450 | Package of integrated circuits having a light-to-heat-conversion coating material | Hsien-Ju Tsou, Chih-Wei Wu, Pu Wang, Szu-Wei Lu, Jing-Cheng Lin | 2021-02-09 |
| 10879194 | Semiconductor device package and method of manufacturing the same | Jing-Cheng Lin, Li-Hui Cheng, Po-Hao Tsai, Jeh-Yin Chang, Li-Chung Kuo +3 more | 2020-12-29 |
| 10872862 | Package structure having bridge structure for connection between semiconductor dies and method of fabricating the same | Chih-Wei Wu | 2020-12-22 |
| 10867965 | Package structures and methods of forming the same | Chi-Hsi Wu, Chen-Hua Yu, Chih-Wei Wu, Jing-Cheng Lin, Pu Wang +1 more | 2020-12-15 |
| 10867962 | Packaging process and manufacturing method | Jiun-Ting Chen, Chih-Wei Wu, Szu-Wei Lu | 2020-12-15 |