Issued Patents All Time
Showing 26–50 of 136 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854877 | Semiconductor device and manufacturing method of the same | Jing-Cheng Lin, Pu Wang, Chen-Hua Yu | 2023-12-26 |
| 11842936 | Underfill structure for semiconductor packages and methods of forming the same | Yu-Wei Chen, Li-Chung Kuo, Szu-Wei Lu, Jing-Cheng Lin, Long Hua Lee +1 more | 2023-12-12 |
| 11824040 | Package component, electronic device and manufacturing method thereof | Chih-Wei Wu, Szu-Wei Lu | 2023-11-21 |
| 11810831 | Integrated circuit package and method of forming same | Chen-Hua Yu, Chih-Wei Wu, Szu-Wei Lu | 2023-11-07 |
| 11749607 | Package and method of manufacturing the same | Chih-Wei Wu, Chen-Hua Yu, Kuo-Chung Yee, Szu-Wei Lu | 2023-09-05 |
| 11728254 | Giga interposer integration through chip-on-wafer-on-substrate | Shang-Yun Hou, Hsien-Pin Hu, Sao-Ling Chiu, Wen-Hsin Wei, Ping-Kang Huang +5 more | 2023-08-15 |
| 11694975 | Chip package structure | Jiun-Ting Chen, Szu-Wei Lu, Chih-Wei Wu | 2023-07-04 |
| 11682645 | Plurality of stacked pillar portions on a semiconductor structure | Jung-Hua Chang, Szu-Wei Lu | 2023-06-20 |
| 11621205 | Underfill structure for semiconductor packages and methods of forming the same | Yu-Wei Chen, Li-Chung Kuo, Szu-Wei Lu, Jing-Cheng Lin, Long Hua Lee +1 more | 2023-04-04 |
| 11600595 | Semiconductor package and manufacturing method thereof | Chih-Wei Wu, Szu-Wei Lu | 2023-03-07 |
| 11557568 | Package and manufacturing method thereof | Chih-Wei Wu, Szu-Wei Lu | 2023-01-17 |
| 11527454 | Package structures and methods of forming the same | Chen-Hua Yu, Wen-Hsin Wei, Chi-Hsi Wu, Shang-Yun Hou, Jing-Cheng Lin +2 more | 2022-12-13 |
| 11515267 | Dummy die placement without backside chipping | Chih-Wei Wu, Li-Chung Kuo, Pu Wang, Szu-Wei Lu, Kung-Chen Yeh | 2022-11-29 |
| 11508692 | Package structure and method of fabricating the same | Kung-Chen Yeh, Szu-Wei Lu, Tsung-Fu Tsai | 2022-11-22 |
| 11502056 | Joint structure in semiconductor package and manufacturing method thereof | Kuan-Yu Huang, Chih-Wei Wu, Sung-Hui Huang, Shang-Yun Hou, Cheng-Chieh Li | 2022-11-15 |
| 11482508 | Semiconductor package and manufacturing method thereof | Chih-Wei Wu, Szu-Wei Lu | 2022-10-25 |
| 11482497 | Package structure including a first die and a second die and a bridge die and method of forming the package structure | Yu-Hung Lin, Chih-Wei Wu, Chia-Nan Yuan, An-Jhih Su, Szu-Wei Lu +2 more | 2022-10-25 |
| 11482465 | Thermal interface materials, 3D semiconductor packages and methods of manufacture | Chen-Hua Yu, Szu-Wei Lu, Li-Chung Kuo | 2022-10-25 |
| 11456245 | Silicon interposer including through-silicon via structures with enhanced overlay tolerance and methods of forming the same | Hsien-Ju Tsou, Chih-Wei Wu, Szu-Wei Lu | 2022-09-27 |
| 11424194 | Three dimensional integrated circuit (3DIC) with support structures | Chih-Wei Wu, Szu-Wei Lu, Jing-Cheng Lin | 2022-08-23 |
| 11424173 | Integrated circuit package and method of forming same | Chen-Hua Yu, Chih-Wei Wu, Szu-Wei Lu | 2022-08-23 |
| 11417580 | Package structures and methods of forming the same | Chen-Hua Yu, Wen-Hsin Wei, Chi-Hsi Wu, Shang-Yun Hou, Jing-Cheng Lin +2 more | 2022-08-16 |
| 11410897 | Semiconductor structure having a dielectric layer edge covering circuit carrier | Chih-Wei Wu, Szu-Wei Lu | 2022-08-09 |
| 11296032 | Silicon interposer including through-silicon via structures with enhanced overlay tolerance and methods of forming the same | Hsien-Ju Tsou, Chih-Wei Wu, Szu-Wei Lu | 2022-04-05 |
| 11289424 | Package and method of manufacturing the same | Chih-Wei Wu, Chen-Hua Yu, Kuo-Chung Yee, Szu-Wei Lu | 2022-03-29 |