Issued Patents All Time
Showing 76–100 of 136 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10861799 | Dummy die placement without backside chipping | Chih-Wei Wu, Li-Chung Kuo, Pu Wang, Szu-Wei Lu, Kung-Chen Yeh | 2020-12-08 |
| 10847414 | Embedded 3D interposer structure | Jing-Cheng Lin, Wen-Chih Chiou, Shin-Puu Jeng, Chen-Hua Yu | 2020-11-24 |
| 10818583 | Semiconductor devices, methods of manufacture thereof, and semiconductor device packages | I-Ting Chen, Po-Hao Tsai, Szu-Wei Lu, Jing-Cheng Lin | 2020-10-27 |
| 10804178 | Integrated circuit package and method of forming same | Chen-Hua Yu, Chih-Wei Wu, Szu-Wei Lu | 2020-10-13 |
| 10770365 | Package structures and methods of forming the same | Chen-Hua Yu, Hsien-Pin Hu, Jing-Cheng Lin, Szu-Wei Lu, Shang-Yun Hou +2 more | 2020-09-08 |
| 10756058 | Semiconductor package and manufacturing method thereof | Chih-Wei Wu, Szu-Wei Lu | 2020-08-25 |
| 10586763 | Semiconductor device and method of manufacture | Hsien-Ju Tsou, Chih-Wei Wu, Jing-Cheng Lin, Pu Wang, Szu-Wei Lu | 2020-03-10 |
| 10535639 | Semiconductor device and manufacturing method of the same | Jing-Cheng Lin, Pu Wang, Chen-Hua Yu | 2020-01-14 |
| 10529637 | Integrated circuit package and method of forming same | Chen-Hua Yu, Chih-Wei Wu, Szu-Wei Lu | 2020-01-07 |
| 10529690 | Package structures and methods of forming the same | Chi-Hsi Wu, Chen-Hua Yu, Chih-Wei Wu, Jing-Cheng Lin, Pu Wang +1 more | 2020-01-07 |
| 10510732 | PoP device and method of forming the same | Hsien-Ju Tsou, Chih-Wei Wu, Jing-Cheng Lin, Pu Wang, Szu-Wei Lu | 2019-12-17 |
| 10510595 | Integrated fan-out packages and methods of forming the same | Chih-Wei Wu, Szu-Wei Lu, Jing-Cheng Lin, Long Hua Lee | 2019-12-17 |
| 10510684 | Three dimensional integrated circuit (3DIC) with support structures | Chih-Wei Wu, Szu-Wei Lu, Jing-Cheng Lin | 2019-12-17 |
| 10497616 | Embedded 3D interposer structure | Jing-Cheng Lin, Wen-Chih Chiou, Shin-Puu Jeng, Chen-Hua Yu | 2019-12-03 |
| 10497690 | Semiconductor package, method for forming semiconductor package, and method for forming semiconductor assembly | Hsien-Ju Tsou, Chih-Wei Wu, Pu Wang, Szu-Wei Lu, Jing-Cheng Lin | 2019-12-03 |
| 10483234 | Chip packages and methods of manufacture thereof | Chih-Wei Wu, Jing-Cheng Lin, Szu-Wei Lu | 2019-11-19 |
| 10340253 | Package structure and method of manufacturing the same | Shu-Hang Liao, Chih-Wei Wu, Jing-Cheng Lin, Szu-Wei Lu | 2019-07-02 |
| 10290609 | Semiconductor device and manufacturing method of the same | Jing-Cheng Lin, Pu Wang, Chen-Hua Yu | 2019-05-14 |
| 10269589 | Method of manufacturing a release film as isolation film in package | Hsien-Ju Tsou, Chih-Wei Wu, Pu Wang, Szu-Wei Lu, Jing-Cheng Lin | 2019-04-23 |
| 10170441 | Semiconductor structure and manufacturing method thereof | Chih-Wei Wu, Szu-Wei Lu, Jing-Cheng Lin | 2019-01-01 |
| 10170295 | Flux residue cleaning system and method | I-Ting Chen, Jing-Cheng Lin, Szu-Wei Lu | 2019-01-01 |
| 10157870 | Integrated fan-out package and method of fabricating the same | Chih-Wei Wu, Jing-Cheng Lin, Szu-Wei Lu | 2018-12-18 |
| 10157879 | Die-to-die gap control for semiconductor structure and method | Jing-Cheng Lin, Szu-Wei Lu, Ying-Da Wang, Li-Chung Kuo, Long Hua Lee +2 more | 2018-12-18 |
| 10157850 | Semiconductor packages and manufacturing method thereof | Chih-Wei Wu, Jing-Cheng Lin, Szu-Wei Lu | 2018-12-18 |
| 10153222 | Package structures and methods of forming the same | Chen-Hua Yu, Hsien-Pin Hu, Jing-Cheng Lin, Szu-Wei Lu, Shang-Yun Hou +2 more | 2018-12-11 |