Issued Patents All Time
Showing 101–125 of 242 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510716 | Packaged semiconductor devices and methods of packaging semiconductor devices | Chen-Hua Yu, Chung-Shi Liu, Chih-Fan Huang, Hui-Min Huang, Ming-Da Cheng | 2019-12-17 |
| 10475679 | Semiconductor processing boat design with pressure sensor | Ai-Tee Ang, Hsiu-Jen Lin, Ming-Da Cheng, Chung-Shi Liu | 2019-11-12 |
| 10445002 | Data accessing method, memory controlling circuit unit and memory storage device | An-Cheng Liu, Lih Yuarn Ou, Szu-Wei Chen | 2019-10-15 |
| 10424391 | Decoding method, memory controlling circuit unit and memory storage device | Yu-Cheng Hsu, Szu-Wei Chen, Yu-Siang Yang | 2019-09-24 |
| 10409674 | Decoding method, memory control circuit unit and memory storage apparatus | Tien-Ching Wang, Kuo-Hsin Lai | 2019-09-10 |
| 10373931 | Semiconductor package structure and method of manufacturing the same | Jeng-Nan Hung, Chun-Hui Yu, Kuo-Chung Yee, Yi-Da Tsai, Ming-Da Cheng +1 more | 2019-08-06 |
| 10373941 | Package-on-package structures and methods for forming the same | Kuei-Wei Huang, Chih-Wei Lin, Hsiu-Jen Lin, Ming-Da Cheng, Chung-Shi Liu | 2019-08-06 |
| 10310941 | Data encoding method, memory control circuit unit and memory storage device | Chih-Kang Yeh, Yu-Cheng Hsu, Szu-Wei Chen | 2019-06-04 |
| 10283427 | Molding structure for wafer level package | Chen-Hua Yu, Chung-Shi Liu, Chih-Fan Huang, Chih-Wei Lin, Ming-Da Cheng | 2019-05-07 |
| 10269673 | Packaged semiconductor devices and methods of packaging semiconductor devices | Chen-Hua Yu, Chung-Shi Liu, Chih-Fan Huang, Chih-Wei Lin, Ming-Da Cheng | 2019-04-23 |
| 10269763 | Package-on-package structure having polymer-based material for warpage control | Meng-Tse Chen, Yu-Chih Liu, Hui-Min Huang, Jing Ruei Lu, Ming-Da Cheng +1 more | 2019-04-23 |
| 10192804 | Bump-on-trace packaging structure and method for forming the same | Meng-Tse Chen, Chih-Wei Lin, Kuei-Wei Huang, Hui-Min Huang, Ming-Da Cheng +1 more | 2019-01-29 |
| 10177104 | Package on package structure and method for forming the same | Chen-Hua Yu, Chung-Shi Liu, Ming-Da Cheng, Mirng-Ji Lii, Meng-Tse Chen | 2019-01-08 |
| 10170434 | Warpage control in package-on-package structures | Wei-Yu Chen, Yu-Hsiang Hu, Ming-Da Cheng, Chung-Shi Liu | 2019-01-01 |
| 10163804 | Molding structure for wafer level package | Chen-Hua Yu, Chung-Shi Liu, Chih-Fan Huang, Hui-Min Huang, Ming-Da Cheng | 2018-12-25 |
| 10159874 | Luminous ball | — | 2018-12-25 |
| 10153180 | Semiconductor bonding structures and methods | Meng-Tse Chen, Hsiu-Jen Lin, Kuei-Wei Huang, Ming-Da Cheng, Chung-Shi Liu | 2018-12-11 |
| 10141281 | Substrate and package structure | Hsiu-Jen Lin, Ming-Da Cheng, Yu-Min Liang, Chen-Shien Chen, Chung-Shi Liu | 2018-11-27 |
| 10134717 | Semiconductor package, semiconductor device and method of forming the same | Chen-Hua Yu, Chung-Shi Liu, Chih-Fan Huang, Tsai-Tsung Tsai, Ming-Da Cheng | 2018-11-20 |
| 10134703 | Package on-package process for applying molding compound | Meng-Tse Chen, Sheng-Yu Wu, Bor-Ping Jang, Ming-Da Cheng, Chung-Shi Liu +6 more | 2018-11-20 |
| 10074433 | Data encoding method, memory control circuit unit and memory storage device | Yu-Cheng Hsu, Yu-Siang Yang | 2018-09-11 |
| 10067824 | Error processing method, memory storage device and memory controlling circuit unit | Yu-Cheng Hsu, Shao-Wei Yen, Tien-Ching Wang, Yu-Hsiang Lin, Kuo-Hsin Lai +1 more | 2018-09-04 |
| 10049894 | Package structures and methods for forming the same | Hsien-Liang Meng, Yu-Min Liang, Ming-Che Ho, Hung-Jui Kuo, Chung-Shi Liu +1 more | 2018-08-14 |
| 10025660 | Data reading method, memory control circuit unit and memory storage apparatus | Tien-Ching Wang, Kuo-Hsin Lai | 2018-07-17 |
| 10014260 | Package structure and method for forming the same | Yi-Da Tsai, Cheng Ping Lin, Chih-Wei Lin, Ming-Da Cheng, Ching-Hua Hsieh +1 more | 2018-07-03 |