Issued Patents All Time
Showing 126–150 of 242 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9972390 | Two pass memory programming method, memory control circuit unit and memory storage apparatus | Yu-Cheng Hsu, Szu-Wei Chen | 2018-05-15 |
| 9947417 | Memory management method, memory storage device and memory controlling circuit unit | Yu-Cheng Hsu | 2018-04-17 |
| 9941221 | Warpage control in package-on-package structures | Wei-Yu Chen, Yu-Hsiang Hu, Ming-Da Cheng, Chung-Shi Liu | 2018-04-10 |
| 9935091 | Package-on-package structures and methods for forming the same | Kuei-Wei Huang, Chih-Wei Lin, Hsiu-Jen Lin, Ming-Da Cheng, Chung-Shi Liu | 2018-04-03 |
| 9911674 | Molding structure for wafer level package | Chen-Hua Yu, Chung-Shi Liu, Chih-Fan Huang, Chih-Wei Lin, Ming-Da Cheng | 2018-03-06 |
| 9911675 | Packaged semiconductor devices and methods of packaging semiconductor devices | Chen-Hua Yu, Chung-Shi Liu, Chih-Fan Huang, Chih-Wei Lin, Ming-Da Cheng | 2018-03-06 |
| 9911633 | Semiconductor processing boat design with pressure sensor | Ai-Tee Ang, Hsiu-Jen Lin, Ming-Da Cheng, Chung-Shi Liu | 2018-03-06 |
| 9892799 | Read voltage tracking method, memory storage device and memory control circuit unit | Yu-Cheng Hsu, An-Cheng Liu | 2018-02-13 |
| 9891991 | Decoding method, memory storage device and memory control circuit unit | — | 2018-02-13 |
| 9887162 | Molding structure for wafer level package | Chen-Hua Yu, Chung-Shi Liu, Chih-Fan Huang, Hui-Min Huang, Ming-Da Cheng | 2018-02-06 |
| 9871018 | Packaged semiconductor devices and methods of packaging semiconductor devices | Chen-Hua Yu, Chung-Shi Liu, Chih-Fan Huang, Hui-Min Huang, Ming-Da Cheng | 2018-01-16 |
| 9865574 | Alignment in the packaging of integrated circuits | Kuei-Wei Huang, Chih-Wei Lin, Ming-Da Cheng, Chung-Shi Liu | 2018-01-09 |
| 9859229 | Package structure and method for forming the same | Yu-Peng Tsai, Sheng-Feng Weng, Sheng-Hsiang Chiu, Meng-Tse Chen, Chih-Wei Lin +3 more | 2018-01-02 |
| 9837278 | Wafer level chip scale package and method of manufacturing the same | Yu-Hsiang Hu, Wei-Yu Chen, Hung-Jui Kuo, Ming-Da Cheng, Chung-Shi Liu | 2017-12-05 |
| 9837435 | Three-dimensional non-volatile memory structure and manufacturing method thereof | Chun-Yen Chang, Chun-Hu Cheng, Yu-Chien Chiu, Chien-Hsin Liu | 2017-12-05 |
| 9821196 | Luminous ball | — | 2017-11-21 |
| 9812194 | Decoding method, memory storage device and memory control circuit unit | Yu-Cheng Hsu, Szu-Wei Chen | 2017-11-07 |
| 9799631 | Semiconductor packaging structure and method | Chun-Cheng Lin, Chung-Shi Liu, Kuei-Wei Huang, Cheng-Ting Chen, Ming-Da Cheng | 2017-10-24 |
| 9776048 | Light releasing sphere structure | — | 2017-10-03 |
| 9761551 | Solder joint structure for ball grid array in wafer level package | Yu-Hsiang Hu, Wei-Yu Chen, Ming-Da Cheng, Chung-Shi Liu | 2017-09-12 |
| 9715429 | Decoding method, memory storage device and memory control circuit unit | — | 2017-07-25 |
| 9711470 | Package on package structure and method for forming the same | Chen-Hua Yu, Chung-Shi Liu, Ming-Da Cheng, Mirng-Ji Lii, Meng-Tse Chen | 2017-07-18 |
| 9703698 | Data writing method, memory controller and memory storage apparatus | Kuo-Yi Cheng, Kim-Hon Wong, Hao-Zhi Lee, Hung-Chun Lin, Chun-Yen Chang | 2017-07-11 |
| 9673182 | Package on package bonding structure and method for forming the same | Kuei-Wei Huang, Wei-Yu Chen, Meng-Tse Chen, Ming-Da Cheng, Chung-Shi Liu | 2017-06-06 |
| 9639419 | Read voltage level estimating method, memory storage device and memory control circuit unit | Tien-Ching Wang, Kuo-Hsin Lai | 2017-05-02 |