Issued Patents All Time
Showing 76–100 of 242 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10950514 | Packaged semiconductor devices and methods of packaging semiconductor devices | Chen-Hua Yu, Chung-Shi Liu, Chih-Fan Huang, Chih-Wei Lin, Ming-Da Cheng | 2021-03-16 |
| 10936248 | Data writing method with verifying a part of data, memory controlling circuit unit and memory storage device | Yu-Cheng Hsu | 2021-03-02 |
| 10923212 | Memory control method, memory storage device and memory control circuit unit | An-Cheng Liu, Yu-Cheng Hsu, Yu-Siang Yang | 2021-02-16 |
| 10892026 | Memory management method, memory storage device and memory control circuit unit | An-Cheng Liu, Szu-Wei Chen, Yu-Siang Yang | 2021-01-12 |
| 10872667 | Decoding method, memory controlling circuit unit and memory storage device | Yu-Cheng Hsu, Szu-Wei Chen | 2020-12-22 |
| 10867932 | Method for manufacturing package structure | Yi-Da Tsai, Cheng Ping Lin, Chih-Wei Lin, Ming-Da Cheng, Ching-Hua Hsieh +1 more | 2020-12-15 |
| 10857428 | Luminous ball with remote activation capability | — | 2020-12-08 |
| 10832999 | Packaging methods for semiconductor devices comprising forming trenches in separation regions between adjacent packaging substrates | Kuei-Wei Huang, Chih-Wei Lin, Chun-Cheng Lin, Meng-Tse Chen, Ming-Da Cheng +1 more | 2020-11-10 |
| 10797025 | Advanced INFO POP and method of forming thereof | Yi-Da Tsai, Meng-Tse Chen, Sheng-Feng Weng, Sheng-Hsiang Chiu, Ming-Da Cheng +2 more | 2020-10-06 |
| 10776053 | Memory control method, memory storage device and memory control circuit unit | Yu-Cheng Hsu, Szu-Wei Chen, Yu-Siang Yang | 2020-09-15 |
| 10734263 | Semiconductor processing boat design with pressure sensor | Ai-Tee Ang, Hsiu-Jen Lin, Ming-Da Cheng, Chung-Shi Liu | 2020-08-04 |
| 10707084 | Method of manufacturing wafer level chip scale package | Yu-Hsiang Hu, Wei-Yu Chen, Hung-Jui Kuo, Ming-Da Cheng, Chung-Shi Liu | 2020-07-07 |
| 10685711 | Decoding method, memory controlling circuit unit and memory storage device | Lih Yuarn Ou, Yu-Siang Yang | 2020-06-16 |
| 10679707 | Voltage adjusting method, memory controlling circuit unit and memory storage device | Yu-Cheng Hsu, Tsai-Hao Kuo, Szu-Wei Chen, Lih Yuarn Ou, Hsiao-Yi Lin | 2020-06-09 |
| 10628259 | Bit determining method, memory control circuit unit and memory storage device | An-Cheng Liu, Yu-Siang Yang, Yu-Cheng Hsu | 2020-04-21 |
| 10629508 | Packaged semiconductor devices and methods of packaging semiconductor devices | Chen-Hua Yu, Chung-Shi Liu, Chih-Fan Huang, Chih-Wei Lin, Ming-Da Cheng | 2020-04-21 |
| 10622077 | Decoding method, memory storage device and memory control circuit unit | Yu-Cheng Hsu, Szu-Wei Chen, Tien-Ching Wang | 2020-04-14 |
| 10600709 | Bump-on-trace packaging structure and method for forming the same | Meng-Tse Chen, Chih-Wei Lin, Kuei-Wei Huang, Hui-Min Huang, Ming-Da Cheng +1 more | 2020-03-24 |
| 10586596 | Data writing method, memory control circuit unit and memory storage apparatus | Yu-Cheng Hsu, Szu-Wei Chen | 2020-03-10 |
| 10559546 | Package on package structure and method for forming the same | Chen-Hua Yu, Chung-Shi Liu, Ming-Da Cheng, Mirng-Ji Lii, Meng-Tse Chen | 2020-02-11 |
| 10535616 | Warpage control in package-on-package structures | Wei-Yu Chen, Yu-Hsiang Hu, Ming-Da Cheng, Chung-Shi Liu | 2020-01-14 |
| 10535609 | Package structure and method for forming the same | Yi-Da Tsai, Cheng Ping Lin, Chih-Wei Lin, Ming-Da Cheng, Ching-Hua Hsieh +1 more | 2020-01-14 |
| 10522452 | Packaging methods for semiconductor devices including forming trenches in workpiece to separate adjacent packaging substrates | Kuei-Wei Huang, Chih-Wei Lin, Chun-Cheng Lin, Meng-Tse Chen, Ming-Da Cheng +1 more | 2019-12-31 |
| 10522234 | Bit tagging method, memory control circuit unit and memory storage device | Yu-Hsiang Lin, Yu-Cheng Hsu | 2019-12-31 |
| 10510630 | Molding structure for wafer level package | Chen-Hua Yu, Chung-Shi Liu, Chih-Fan Huang, Chih-Wei Lin, Ming-Da Cheng | 2019-12-17 |