Issued Patents All Time
Showing 26–50 of 242 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12027435 | Packages including multiple encapsulated substrate blocks and overlapping redistribution structures | Chen-Shien Chen, Kuo-Ching Hsu, Hui-Min Huang, Ming-Da Cheng, Mirng-Ji Lii | 2024-07-02 |
| 12021037 | Method for manufacturing package structure | Yi-Da Tsai, Cheng Ping Lin, Chih-Wei Lin, Ming-Da Cheng, Ching-Hua Hsieh +1 more | 2024-06-25 |
| 12015002 | Chip structure and method for forming the same | Hui-Min Huang, Ming-Da Cheng, Chang-Jung Hsueh, Kai Jun Zhan, Yung-Sheng Lin | 2024-06-18 |
| 12008262 | Read voltage control method, memory storage device and memory control circuit unit | Shih-Jia Zeng, Chun Tsao, Chih-Wei Wang | 2024-06-11 |
| 12001560 | Method and system for avoiding boot failure from platform firmware resilience execution | Tzu-Heng Wen, Yen-Ping Tung | 2024-06-04 |
| 11990440 | Structure and formation method of semiconductor device with conductive bumps | Hui-Min Huang, Ming-Da Cheng, Chang-Jung Hsueh, Kai Jun Zhan, Yung-Sheng Lin | 2024-05-21 |
| 11972139 | Read voltage level correction method, memory storage device, and memory control circuit unit | Shih-Jia Zeng, Chun Tsao, Hsiao-Yi Lin | 2024-04-30 |
| 11961817 | Apparatus and method for forming a package structure | Kai Jun Zhan, Chang-Jung Hsueh, Hui-Min Huang, Ming-Da Cheng | 2024-04-16 |
| 11962328 | Decoding method, memory storage device and memory control circuit unit | Shih-Jia Zeng, Yi Fang Chang, Chun Tsao, Chen-An Hsu | 2024-04-16 |
| 11955460 | Advanced info POP and method of forming thereof | Yi-Da Tsai, Meng-Tse Chen, Sheng-Feng Weng, Sheng-Hsiang Chiu, Ming-Da Cheng +2 more | 2024-04-09 |
| 11901256 | Semiconductor device, semiconductor package, and methods of manufacturing the same | Chang-Jung Hsueh, Cheng-Nan Lin, Wan-Yu Chiang, Ching-Wen Hsiao, Ming-Da Cheng | 2024-02-13 |
| 11894332 | Substrate and package structure | Hsiu-Jen Lin, Ming-Da Cheng, Yu-Min Liang, Chen-Shien Chen, Chung-Shi Liu | 2024-02-06 |
| 11887955 | Semiconductor die including stress-resistant bonding structures and methods of forming the same | Hui-Min Huang, Ming-Da Cheng, Chang-Jung Hsueh, Kai Jun Zhan, Wan-Yu Chiang | 2024-01-30 |
| 11855058 | Package structure and method of forming the same | Hui-Min Huang, Chang-Jung Hsueh, Wan-Yu Chiang, Ming-Da Cheng, Mirng-Ji Lii | 2023-12-26 |
| 11854964 | Structure and formation method of semiconductor device with conductive bumps | Ming-Da Cheng, Hui-Min Huang, Chang-Jung Hsueh, Po-Hao Tsai, Yung-Sheng Lin | 2023-12-26 |
| 11842935 | Method for forming a reconstructed package substrate comprising substrates blocks | Chen-Shien Chen, Kuo-Ching Hsu, Hui-Min Huang, Ming-Da Cheng, Mirng-Ji Lii | 2023-12-12 |
| 11829644 | Memory control method, memory storage device, and memory control circuit unit | Po-Cheng Su, Chih-Wei Wang, Yu-Cheng Hsu | 2023-11-28 |
| 11822505 | Systems and methods for remote management of a network device | Yen-Ping Tung | 2023-11-21 |
| 11809706 | Memory management method, memory storage device, and memory control circuit unit | Yu-Siang Yang, Yu-Cheng Hsu, Tsai-Hao Kuo, An-Cheng Liu | 2023-11-07 |
| 11797222 | Read disturb checking method, memory storage device and memory control circuit unit | Shih-Jia Zeng, Po-Cheng Su, Chih-Wei Wang | 2023-10-24 |
| 11749535 | Semiconductor bonding structures and methods | Meng-Tse Chen, Hsiu-Jen Lin, Kuei-Wei Huang, Ming-Da Cheng, Chung-Shi Liu | 2023-09-05 |
| 11742204 | Multi-layer structures and methods of forming | Chang-Jung Hsueh, Chen-En Yen, Chin Wei Kang, Kai Jun Zhan, Cheng-Jen Lin +3 more | 2023-08-29 |
| 11726709 | Memory control method, memory storage device and memory control circuit unit | Shih-Jia Zeng, Yu-Siang Yang, Szu-Wei Chen | 2023-08-15 |
| 11726570 | Surface classifications | Tai Hsiang Chen, Charles J. Stancil, Kun-Hung Lin | 2023-08-15 |
| 11664287 | Packaged semiconductor devices and methods of packaging semiconductor devices | Chen-Hua Yu, Chung-Shi Liu, Chih-Fan Huang, Chih-Wei Lin, Ming-Da Cheng | 2023-05-30 |