Issued Patents All Time
Showing 26–50 of 54 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522360 | Method for forming semiconductor device structure with etch stop layer | Ya-Ling Lee, Keng-Chu Lin, Wen-Cheng Yang, Chih-Tsung Lee, Victor Lu | 2019-12-31 |
| 10515788 | Systems and methods for integrated resputtering in a physical vapor deposition chamber | Ching-Hua Hsieh, Ming-Hsing Tsai, Syun-Ming Jang | 2019-12-24 |
| 10510585 | Multi-patterning to form vias with straight profiles | Chun-Kai Chen, Jung-Hau Shiu, Chia-Cheng Chou, Chung-Chi Ko, Tze-Liang Lee +1 more | 2019-12-17 |
| 10468297 | Metal-based etch-stop layer | Szu-Ping Tung, Yu-Kai Lin, Jen Hung Wang | 2019-11-05 |
| 10361112 | High aspect ratio gap fill | Wan-Lin Tsai, Sung-En Lin, Tze-Liang Lee, Jung-Hau Shiu, Jen Hung Wang | 2019-07-23 |
| 10312107 | Forming interconnect structure using plasma treated metal hard mask | Chung-Chi Ko, Chia-Cheng Chou, Keng-Chu Lin, Shwang-Ming Jeng | 2019-06-04 |
| 9887072 | Systems and methods for integrated resputtering in a physical vapor deposition chamber | Ching-Hua Hsieh, Ming-Hsing Tsai, Syun-Ming Jang | 2018-02-06 |
| 9818638 | Manufacturing method of semiconductor device | Yu-Yun Peng, Chung-Chi Ko | 2017-11-14 |
| 9679804 | Multi-patterning to form vias with straight profiles | Chun-Kai Chen, Jung-Hau Shiu, Chia-Cheng Chou, Chung-Chi Ko, Tze-Liang Lee +1 more | 2017-06-13 |
| 9659811 | Manufacturing method of semiconductor device | Yu-Yun Peng, Chung-Chi Ko | 2017-05-23 |
| 9567668 | Plasma apparatus, magnetic-field controlling method, and semiconductor manufacturing method | Chih-Chien Chi, Kuan-Chia Chen, Yao-Jen Chang, Huang-Yi Huang, Ching-Hua Hsieh | 2017-02-14 |
| 9472449 | Semiconductor structure with inlaid capping layer and method of manufacturing the same | Kuan-Chia Chen, Chih-Chien Chi, Ching-Hua Hsieh | 2016-10-18 |
| 9385086 | Bi-layer hard mask for robust metallization profile | Ching-Hua Hsieh, Hong-Hui Hsu | 2016-07-05 |
| 9330915 | Surface pre-treatment for hard mask fabrication | Ching-Hua Hsieh, Hong-Hui Hsu, Yao-Jen Chang | 2016-05-03 |
| 8361900 | Barrier layer for copper interconnect | Han-Hsin Kuo, Chung-Chi Ko, Ching-Hua Hsieh | 2013-01-29 |
| 8252690 | In situ Cu seed layer formation for improving sidewall coverage | Li-Lin Su, Cheng-Lin Huang, Ching-Hua Hsieh | 2012-08-28 |
| 8034709 | Method for forming composite barrier layer | Cheng-Lin Huang, Ching-Hua Hsieh, Hsien-Ming Lee, Chao-Hsien Peng, Li-Lin Su +3 more | 2011-10-11 |
| RE41935 | Method for preventing low-k dielectric layer cracking in multi-layered dual damascene metallization layers | Keng-Chu Lin, Wen-Chih Chiou, Shwang-Ming Jeng | 2010-11-16 |
| 7805258 | System and method for film stress and curvature gradient mapping for screening problematic wafers | Hsueh-Hung Fu, Chih-Wei Chang, Shih-Chang Chen, Chin-Piao Chang, Wei-Jung Lin +1 more | 2010-09-28 |
| 7704886 | Multi-step Cu seed layer formation for improving sidewall coverage | Li-Lin Su, Cheng-Lin Huang, Ching-Hua Hsieh | 2010-04-27 |
| 7453149 | Composite barrier layer | Cheng-Lin Huang, Ching-Hua Hsieh, Hsien-Ming Lee, Chao-Hsien Peng, Li-Lin Su +3 more | 2008-11-18 |
| 7253501 | High performance metallization cap layer | Hsien-Ming Lee, Jing-Cheng Lin, Ching-Hua Hsieh, Chao-Hsien Peng, Cheng-Lin Huang +2 more | 2007-08-07 |
| 7247252 | Method of avoiding plasma arcing during RIE etching | Yu-Chun Huang, Shwangming Jing | 2007-07-24 |
| 7226860 | Method and apparatus for fabricating metal layer | Hsien-Ming Lee, Jing-Cheng Lin, Ming-Hsing Tsai, Hung-Wen Su, Shih-Wei Chou +3 more | 2007-06-05 |
| 7193327 | Barrier structure for semiconductor devices | Chen-Hua Yu, Shau-Lin Shue, Ching-Hua Hsieh, Cheng-Lin Huang, Hsien-Ming Lee +1 more | 2007-03-20 |