Issued Patents All Time
Showing 51–54 of 54 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7030023 | Method for simultaneous degas and baking in copper damascene process | Ching-Hua Hsieh, Jing-Cheng Lin, Hsien-Ming Lee, Cheng-Lin Huang, Shau-Lin Shue | 2006-04-18 |
| 6846756 | Method for preventing low-k dielectric layer cracking in multi-layered dual damascene metallization layers | Keng-Chu Lin, Wen-Chih Chiou, Shwang-Ming Jeng | 2005-01-25 |
| 6821905 | Method for avoiding carbon and nitrogen contamination of a dielectric insulating layer | Shwang-Ming Jeng, Chen-Hua Yu, Grace H. Ho | 2004-11-23 |
| 6656832 | Plasma treatment method for fabricating microelectronic fabrication having formed therein conductor layer with enhanced electrical properties | Keng-Chu Lin, Shwangming Jen | 2003-12-02 |