Issued Patents All Time
Showing 51–75 of 84 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163974 | Method of forming absorption enhancement structure for image sensor | Ching-Chung Su, Hung-Wen Hsu, Jiech-Fun Lu | 2018-12-25 |
| 10163956 | Interconnect apparatus and method | Jeng-Shyan Lin, Shu-Ting Tsai, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung +2 more | 2018-12-25 |
| 10157891 | 3DIC interconnect apparatus and method | Shu-Ting Tsai, Dun-Nian Yaung, Jen-Cheng Liu, U-Ting Chen | 2018-12-18 |
| 10128113 | Semiconductor structure and manufacturing method thereof | Chen-Fa Lu, Jiech-Fun Lu, Yeur-Luen Tu, Chia-Shiung Tsai | 2018-11-13 |
| 10096515 | Interconnect structure for stacked device | Shu-Ting Tsai, Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung +3 more | 2018-10-09 |
| 10074612 | Method for forming alignment marks and structure of same | Cheng-Hsien Chou, Sheng-Chau Chen, Chun-Wei Chang, Kai-Chun Hsu, Chih-Yu Lai +7 more | 2018-09-11 |
| 10062720 | Deep trench isolation fabrication for BSI image sensor | Yen-Ting Chiang, Ching-Chun Wang, Dun-Nian Yaung, Hsiao-Hui Tseng, Chih-Hui Huang +2 more | 2018-08-28 |
| 10038026 | Bond pad structure for bonding improvement | Sin-Yao Huang, Ching-Chun Wang, Dun-Nian Yaung, Feng-Chi Hung, Ming-Tsong Wang | 2018-07-31 |
| 10008531 | Varied STI liners for isolation structures in image sensing devices | Cheng-Hsien Chou, Chia-Shiung Tsai, Feng-Chi Hung, Jiech-Fun Lu, Min-Feng Kao +1 more | 2018-06-26 |
| 9991303 | Image sensor device structure | Hung-Wen Hsu, Ching-Chung Su, Cheng-Hsien Chou, Jiech-Fun Lu, Yeur-Luen Tu | 2018-06-05 |
| 9941320 | 3DIC interconnect apparatus and method | Hung-Wen Hsu, Ching-Chung Su, Chun-Han Tsao, Chia-Chieh Lin, Shu-Ting Tsai +4 more | 2018-04-10 |
| 9887182 | 3DIC structure and method for hybrid bonding semiconductor wafers | Ju-Shi Chen, Cheng-Ying Ho, Chun-Chieh Chuang, Sheng-Chau Chen, Hui-Wen Shen +4 more | 2018-02-06 |
| 9842816 | Conductive pad structure for hybrid bonding and methods of forming same | Sheng-Chau Chen, Yen-Chang Chu, Cheng-Hsien Chou, Chih-Hui Huang, Yeur-Luen Tu | 2017-12-12 |
| 9786619 | Semiconductor structure and manufacturing method thereof | Sheng-Chau Chen, Ming-Jhe Lee, Kuo-Ming Wu, Cheng-Hsien Chou, Cheng-Yuan Tsai +1 more | 2017-10-10 |
| 9754925 | 3DIC interconnect apparatus and method | Shu-Ting Tsai, Dun-Nian Yaung, Jen-Cheng Liu, U-Ting Chen | 2017-09-05 |
| 9754993 | Deep trench isolations and methods of forming the same | Cheng-Hsien Chou, Hsiao-Hui Tseng, Chih-Yu Lai, Yen-Ting Chiang, Min-Ying Tsai | 2017-09-05 |
| 9728570 | Deep trench isolation fabrication for BSI image sensor | Yen-Ting Chiang, Ching-Chun Wang, Dun-Nian Yaung, Hsiao-Hui Tseng, Chih-Hui Huang +2 more | 2017-08-08 |
| 9666566 | 3DIC structure and method for hybrid bonding semiconductor wafers | Ju-Shi Chen, Cheng-Ying Ho, Chun-Chieh Chuang, Sheng-Chau Chen, Hui-Wen Shen +4 more | 2017-05-30 |
| 9653507 | Deep trench isolation shrinkage method for enhanced device performance | Cheng-Hsien Chou, Chih-Yu Lai, Sheng-Chau Chen, Chih-Ta Chen, Yeur-Luen Tu +1 more | 2017-05-16 |
| 9627326 | Method for forming alignment marks and structure of same | Cheng-Hsien Chou, Sheng-Chau Chen, Chun-Wei Chang, Kai-Chun Hsu, Chih-Yu Lai +7 more | 2017-04-18 |
| 9553020 | Interconnect structure for connecting dies and methods of forming the same | Shu-Ting Tsai, Dun-Nian Yaung, Jen-Cheng Liu, U-Ting Chen, Chia-Chieh Lin | 2017-01-24 |
| 9536777 | Interconnect apparatus and method | Jeng-Shyan Lin, Shu-Ting Tsai, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung +2 more | 2017-01-03 |
| 9536920 | Stacked image sensor having a barrier layer | U-Ting Chen, Shu-Ting Tsai, Cheng-Ying Ho, Tzu-Hsuan Hsu | 2017-01-03 |
| 9437572 | Conductive pad structure for hybrid bonding and methods of forming same | Sheng-Chau Chen, Yen-Chang Chu, Cheng-Hsien Chou, Chih-Hui Huang, Yeur-Luen Tu | 2016-09-06 |
| 9412719 | 3DIC interconnect apparatus and method | Shu-Ting Tsai, Dun-Nian Yaung, Jen-Cheng Liu, U-Ting Chen | 2016-08-09 |