Issued Patents All Time
Showing 76–100 of 104 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9659973 | Display device | Hung-Kun Chen, Hong-Kang Chang, Hsieh-Li Chou, Yi-Chien Kao, Li-Wei Sung +1 more | 2017-05-23 |
| 9653482 | Display panel and display device | Hsin-Hung Lin, Li-Wei Sung | 2017-05-16 |
| 9633958 | Bonding pad surface damage reduction in a formation of digital pattern generator | Chih Wei Lu, Tsung-Chih Chien, Tien-I Bao | 2017-04-25 |
| 9632375 | Display device | Hung-Kun Chen, Yi-Chin Lee, Hong-Kang Chang, Yi-Chien Kao, Jui-Ching Chu +1 more | 2017-04-25 |
| 9627234 | Method and apparatus for localized and controlled removal of material from a substrate | Chih-Wei Lin, Cheng-Ting Chen, Ming-Da Cheng, Chung-Shi Liu | 2017-04-18 |
| 9627355 | Package-on-package structure having polymer-based material for warpage control | Meng-Tse Chen, Yu-Chih Liu, Wei-Hung Lin, Jing Ruei Lu, Ming-Da Cheng +1 more | 2017-04-18 |
| 9576830 | Method and apparatus for adjusting wafer warpage | Chih-Wei Lin, Wen-Hsiung Lu, Ming-Da Cheng, Chung-Shi Liu | 2017-02-21 |
| 9559005 | Methods of packaging and dicing semiconductor devices and structures thereof | Yu-Peng Tsai, Wen-Hsiung Lu, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2017-01-31 |
| 9524956 | Integrated fan-out structure and method | Hao-Jan Pei, Hsiu-Jen Lin, Ming-Da Cheng, Chung-Shi Liu, Chen-Hua Yu | 2016-12-20 |
| 9508703 | Stacked dies with wire bonds and method | Chen-Hua Yu, Ming-Fa Chen, Sung-Feng Yeh, Meng-Tse Chen, Hsiu-Jen Lin +2 more | 2016-11-29 |
| 9484285 | Interconnect structures for wafer level package and methods of forming same | Meng-Tse Chen, Chih-Wei Lin, Ming-Da Cheng, Chung-Shi Liu, Chen-Hua Yu | 2016-11-01 |
| 9449908 | Semiconductor package system and method | Chih-Wei Lin, Tsai-Tsung Tsai, Ming-Da Cheng, Chung-Shi Liu, Chen-Hua Yu | 2016-09-20 |
| 9390891 | Apparatus for charged particle lithography system | Shih-Chi Wang, Tsung-Chih Chien, Jaw-Jung Shin, Shy-Jay Lin, Burn Jeng Lin | 2016-07-12 |
| 9373508 | Semiconductor device and fabricating method thereof | Ta-Hsun Yeh, Yuh-Sheng Jean | 2016-06-21 |
| 9349663 | Package-on-package structure having polymer-based material for warpage control | Meng-Tse Chen, Yu-Chih Liu, Wei-Hung Lin, Jing Ruei Lu, Ming-Da Cheng +1 more | 2016-05-24 |
| 9299688 | Packaged semiconductor devices and methods of packaging semiconductor devices | Chen-Hua Yu, Chung-Shi Liu, Chih-Fan Huang, Wei-Hung Lin, Ming-Da Cheng | 2016-03-29 |
| 9097924 | Display device | Li-Wei Sung, Yu-Chien Kao, Mei-Ling Kuo | 2015-08-04 |
| 8895367 | Fabrication method of semiconductor package | Jung-Pang Huang, Kuan-Wei Chuang, Chun-Tang Lin, Yih-Jenn Jiang | 2014-11-25 |
| 8745042 | Determining matching degrees between information categories and displayed information | Chang Wang, Jian Ling Shi, Feng Xie, Maojian Fu, Gang Liu | 2014-06-03 |
| 8642445 | Method and apparatus for reducing package warpage | Meng-Tse Chen, Chun-Cheng Lin, Chih-Chun Chiu, Ming-Da Cheng, Chung-Shi Liu | 2014-02-04 |
| 8603911 | Semiconductor device and fabrication method thereof | Chun-Tang Lin, Chien-Wei Lee, Yen-Ping Wang | 2013-12-10 |
| 8564343 | Device of phase locked-loop and the method using the same | — | 2013-10-22 |
| 8519191 | Synthesis method of 3-methylamino-1, 2-propanediol | Zhongfa Zhang, Xueyang Guo | 2013-08-27 |
| 8519526 | Semiconductor package and fabrication method thereof | Jung-Pang Huang, Kuan-Wei Chuang, Chun-Tang Lin, Yih-Jenn Jiang | 2013-08-27 |
| 8033592 | Door assembly and method for a vehicle | Chih-Cheng Hsu, Albert H. Butlin, Jr., John E. Carsley, Stephen R. Koshorek, John N. Owens | 2011-10-11 |