Issued Patents All Time
Showing 26–50 of 104 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538897 | Display device | Li-Wei Sung, Cheng-Tso Chen, Chia-Min Yeh | 2022-12-27 |
| 11532498 | Package-on-package structure | Chih-Wei Lin, Ai-Tee Ang, Yu-Peng Tsai, Ming-Da Cheng, Chung-Shi Liu | 2022-12-20 |
| 11387171 | Method of packaging a semiconductor die | Shou-Cheng Hu, Chih-Wei Lin, Ming-Da Cheng, Chung-Shi Liu, Chen-Shien Chen | 2022-07-12 |
| 11347113 | Electronic device | Shu-Han Yang, Chia-Min Yeh | 2022-05-31 |
| 11289044 | Display device | Chia-Min Yeh, Hsieh-Li Chou, Cheng-Tso Chen, Yu-Chien Kao, Li-Wei Sung | 2022-03-29 |
| 11239103 | Package-on-package structure | Chih-Wei Lin, Ai-Tee Ang, Yu-Peng Tsai, Ming-Da Cheng, Chung-Shi Liu | 2022-02-01 |
| 11184010 | Receiving end of electronic device and method of setting phase threshold of timing recovery operation | Yan-Guei Chen, Hsin-Yu Lue, Liang-Wei Huang | 2021-11-23 |
| 11177137 | Wafer etching process and methods thereof | Wen-Hsiung Lu, Ming-Da Cheng, Wei-Hung Lin, Chen-En Yen, Hsu-Lun Liu | 2021-11-16 |
| 11171100 | Semiconductor device structure with protected bump and method of forming the same | Wei-Hung Lin, Wen-Hsiung Lu, Ming-Da Cheng, Chang-Jung Hsueh, Kuan-Liang Lai | 2021-11-09 |
| 11133285 | Package-on-package structure having polymer-based material for warpage control | Meng-Tse Chen, Yu-Chih Liu, Wei-Hung Lin, Jing Ruei Lu, Ming-Da Cheng +1 more | 2021-09-28 |
| 11121201 | Display device | Li-Wei Sung, Cheng-Tso Chen, Chia-Min Yeh | 2021-09-14 |
| 11094655 | Semiconductor structure and method for forming the same | Wen-Hsiung Lu, Chang-Jung Hsueh, Chin Wei Kang, Wei-Hung Lin, Cheng-Jen Lin +2 more | 2021-08-17 |
| 10985122 | Semiconductor package system and method | Chih-Wei Lin, Tsai-Tsung Tsai, Ming-Da Cheng, Chung-Shi Liu, Chen-Hua Yu | 2021-04-20 |
| 10971107 | Display device | Cheng-Tso Chen, Li-Wei Sung | 2021-04-06 |
| 10903559 | Liquid-crystal antenna device and manufacturing method of the same | Yi-Hung Lin, Chin-Lung Ting, Tang-Chin HUNG | 2021-01-26 |
| 10861827 | 3D package structure and methods of forming same | Meng-Tse Chen, Chung-Shi Liu, Chih-Wei Lin, Hsuan-Ting Kuo, Ming-Da Cheng | 2020-12-08 |
| 10849426 | Rear structure for display panel | Wen-Pin Wang, Yao-Shih Chung, I-Ting Huang, Yu-Jen Chang, Hai-Ping Xiang +6 more | 2020-12-01 |
| 10840111 | Chip package with fan-out structure | Shing-Chao Chen, Chih-Wei Lin, Meng-Tse Chen, Ming-Da Cheng, Kuo Lung Pan +3 more | 2020-11-17 |
| 10770014 | Display device | Chia-Min Yeh, Hung-Hsun Chen, Cheng-Tso Chen, Li-Wei Sung | 2020-09-08 |
| 10655381 | Locking device and opening and closing mechanism having the same | Hui Liu, Kun Wang, Kai Chen, He Zhang, Quan Liu +1 more | 2020-05-19 |
| 10642118 | Display substrate and display device | Hung-Kun Chen, Yi-Chin Lee, Hong-Kang Chang, Yu-Chien Kao, Jui-Ching Chu +1 more | 2020-05-05 |
| 10640391 | LTO coated LRMO cathode and synthesis | Wenkui Zhang, Yang Xia, Liyuang Zhang, Yishun Wang, Chu Liang +3 more | 2020-05-05 |
| 10622240 | Package on-package structure | Chih-Wei Lin, Ai-Tee Ang, Yu-Peng Tsai, Ming-Da Cheng, Chung-Shi Liu | 2020-04-14 |
| 10620656 | Operating voltage switching device with current mirror | Chih-Cheng Lin, Kai Liu | 2020-04-14 |
| 10600709 | Bump-on-trace packaging structure and method for forming the same | Meng-Tse Chen, Wei-Hung Lin, Chih-Wei Lin, Kuei-Wei Huang, Ming-Da Cheng +1 more | 2020-03-24 |