Issued Patents All Time
Showing 151–175 of 525 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10672819 | Mechanisms for forming image-sensor device with deep-trench isolation structure | Jeng-Shyan Lin, Jen-Cheng Liu, Feng-Chi Hung | 2020-06-02 |
| 10629592 | Through silicon via design for stacking integrated circuits | Kong-Beng Thei, Fu-Jier Fan, Hsing-Chih Lin, Hsiao-Chin Tuan, Jen-Cheng Liu +2 more | 2020-04-21 |
| 10629568 | Stacked integrated circuits with redistribution lines | Cheng-Ying Ho, Jeng-Shyan Lin, Wen-I Hsu, Feng-Chi Hung, Ying-Ling Tsai | 2020-04-21 |
| 10622394 | Image sensing device | Wei Chuang Wu, Ming-Tsong Wang, Feng-Chi Hung, Ching-Chun Wang, Jen-Cheng Liu | 2020-04-14 |
| 10566378 | Back side illuminated image sensor with reduced sidewall-induced leakage | Shuang-Ji Tsai, Jen-Cheng Liu, Wen-De Wang, Hsiao-Hui Tseng | 2020-02-18 |
| 10566374 | Via support structure under pad areas for BSI bondability improvement | Sin-Yao Huang, Ching-Chun Wang, Feng-Chi Hung | 2020-02-18 |
| 10566288 | Structure for standard logic performance improvement having a back-side through-substrate-via | Min-Feng Kao, Jen-Cheng Liu, Hsun-Ying Huang | 2020-02-18 |
| 10535706 | Interconnect structure for stacked device and method | Chun-Chieh Chuang, Jen-Cheng Liu, Feng-Chi Hung, Tzu-Hsuan Hsu, Shu-Ting Tsai +1 more | 2020-01-14 |
| 10535697 | Structure and method for 3D Image sensor | Min-Feng Kao, Jen-Cheng Liu, Chun-Chieh Chuang, Feng-Chi Hung, Shuang-Ji Tsai +3 more | 2020-01-14 |
| 10535696 | Pad structure exposed in an opening through multiple dielectric layers in BSI image sensor chips | Jeng-Shyan Lin, Jen-Cheng Liu, Wen-De Wang, Shuang-Ji Tsai, Yueh-Chiou Lin | 2020-01-14 |
| 10522525 | Semiconductor device structure | Cheng-Ying Ho, Wen-De Wang, Jen-Cheng Liu | 2019-12-31 |
| 10522586 | Apparatus for reducing optical cross-talk in image sensors | Chin-Min Lin, Ching-Chun Wang, Chun-Ming Su, Tzu-Hsuan Hsu | 2019-12-31 |
| 10515994 | Semiconductor devices, methods of manufacturing thereof, and image sensor devices | Chun-Chieh Chuang, Jen-Cheng Liu, Tzu-Hsuan Hsu, Feng-Chi Hung, Min-Feng Kao | 2019-12-24 |
| 10515995 | Bond pad structure for bonding improvement | Sin-Yao Huang, Ching-Chun Wang, Feng-Chi Hung, Ming-Tsong Wang, Shih Pei Chou | 2019-12-24 |
| 10510912 | Image sensor device and method | Kuo-Chin Huang, Tzu-Jui Wang, Szu-Ying Chen, Jen-Cheng Liu, Bruce C. S. Chou +2 more | 2019-12-17 |
| 10510793 | Uniform-size bonding patterns | Szu-Ying Chen | 2019-12-17 |
| 10510729 | 3DIC interconnect apparatus and method | Shu-Ting Tsai, Jen-Cheng Liu, U-Ting Chen, Shih Pei Chou | 2019-12-17 |
| 10510730 | Stacked semiconductor structure and method | Szu-Ying Chen, Meng-Hsun Wan | 2019-12-17 |
| 10510592 | Integrated circuit (IC) structure for high performance and functional density | Min-Feng Kao, Hsing-Chih Lin, Jen-Cheng Liu, Kuan-Chieh Huang | 2019-12-17 |
| 10510789 | Extra doped region for back-side deep trench isolation | Chun-Yuan Chen, Ching-Chun Wang, Hsiao-Hui Tseng, Jhy-Jyi Sze, Shyh-Fann Ting +4 more | 2019-12-17 |
| 10510542 | Gate electrodes with notches and methods for forming the same | Min-Feng Kao, Szu-Ying Chen, Jen-Cheng Liu, Tzu-Hsuan Hsu, Feng-Chi Hung | 2019-12-17 |
| 10510790 | High-k dielectric liners in shallow trench isolations | Szu-Ying Chen, Tzu-Jui Wang, Jen-Cheng Liu | 2019-12-17 |
| 10510791 | Elevated photodiode with a stacked scheme | Meng-Hsun Wan, Yi-Shin Chu, Szu-Ying Chen, Pao-Tung Chen, Jen-Cheng Liu | 2019-12-17 |
| 10510792 | 3DIC seal ring structure and methods of forming same | Cheng-Ying Ho, Pao-Tung Chen, Wen-De Wang, Jen-Cheng Liu | 2019-12-17 |
| 10504784 | Inductor structure for integrated circuit | Shih-Han Huang, Ching-Chun Wang, Hsing-Chih Lin, Jen-Cheng Liu, Min-Feng Kao | 2019-12-10 |