Issued Patents All Time
Showing 176–200 of 525 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10490580 | Image sensor pickup region layout | Ching-Chun Wang, Feng-Chi Hung, Jeng-Shyan Lin, Yan-Chih Lu | 2019-11-26 |
| 10475758 | Semiconductor device structure and method for forming the same | Ming-Hsien Yang, Ching-Chun Wang, Feng-Chi Hung, Sin-Yao Huang | 2019-11-12 |
| 10475828 | Image sensor device structure with doping layer in light-sensing region | Yen-Ting Chiang, Chun-Yuan Chen, Hsiao-Hui Tseng, Yu-Jen Wang, Shyh-Fann Ting +2 more | 2019-11-12 |
| 10475843 | Method and apparatus for image sensor packaging | Szu-Ying Chen, Meng-Hsun Wan, Pao-Tung Chen, Jen-Cheng Liu | 2019-11-12 |
| 10468441 | Semiconductor switching device separated by device isolation | Min-Feng Kao, Jen-Cheng Liu, Tzu-Hsuan Hsu, Szu-Ying Chen, Wei-Cheng Hsu +1 more | 2019-11-05 |
| 10468443 | Pixel structure of image sensor and method of forming same | Tzu-Jui Wang, Keng-Yu Chou, Chun-Hao Chuang, Ming-Chieh Hsu, Ren-Jie Lin +1 more | 2019-11-05 |
| 10468448 | Semiconductor image sensor and method for forming the same | Sze Jhy-Jyi, Yimin Huang | 2019-11-05 |
| 10461109 | Multiple deep trench isolation (MDTI) structure for CMOS image sensor | Wei Chuang Wu, Ching-Chun Wang, Feng-Chi Hung, Jen-Cheng Liu, Yen-Ting Chiang +2 more | 2019-10-29 |
| 10388642 | Hybrid bonding with uniform pattern density | Szu-Ying Chen | 2019-08-20 |
| 10361233 | High-k dielectric liners in shallow trench isolations | Szu-Ying Chen, Tzu-Jui Wang, Jen-Cheng Liu | 2019-07-23 |
| 10304818 | Method of manufacturing semiconductor devices having conductive plugs with varying widths | Shu-Ting Tsai, Jen-Cheng Liu, Szu-Ying Chen, U-Ting Chen | 2019-05-28 |
| 10304886 | Back-side deep trench isolation (BDTI) structure for pinned photodiode image sensor | Yen-Ting Chiang, Hsiao-Hui Tseng, Jen-Cheng Liu, Yu-Jen Wang, Chun-Yuan Chen | 2019-05-28 |
| 10297631 | Metal block and bond pad structure | Cheng-Ying Ho, Ching-Chun Wang, Feng-Chi Hung, Yan-Chih Lu | 2019-05-21 |
| 10297632 | Method for an image sensor device | Chun-Han Chen, Szu-Ying Chen | 2019-05-21 |
| 10290671 | Image sensor device and method of forming same | Wen-De Wang, Jen-Cheng Liu, Chun-Chieh Chuang, Jeng-Shyan Lin | 2019-05-14 |
| 10283549 | Via support structure under pad areas for BSI bondability improvement | Sin-Yao Huang, Ching-Chun Wang, Feng-Chi Hung | 2019-05-07 |
| 10276622 | Mechanisms for forming image-sensor device with expitaxial isolation feature | Wen-I Hsu, Feng-Chi Hung, Chun-Chieh Chuang, Jen-Cheng Liu | 2019-04-30 |
| 10276619 | Semiconductor device structure with a conductive feature passing through a passivation layer | Min-Feng Kao, Jen-Cheng Liu, Hsun-Ying Huang | 2019-04-30 |
| 10276618 | Extra doped region for back-side deep trench isolation | Chun-Yuan Chen, Ching-Chun Wang, Hsiao-Hui Tseng, Jhy-Jyi Sze, Shyh-Fann Ting +4 more | 2019-04-30 |
| 10269863 | Methods and apparatus for via last through-vias | Szu-Ying Chen, Pao-Tung Chen, Jen-Cheng Liu | 2019-04-23 |
| 10269848 | Image sensor having enhanced backside illumination quantum efficiency | Yin-Kai Liao, Han-Chi Liu, Yuan-Hung Liu, Jen-Cheng Liu | 2019-04-23 |
| 10269770 | Hybrid bond pad structure | Sin-Yao Huang, Chun-Chieh Chuang, Ching-Chun Wang, Sheng-Chau Chen, Feng-Chi Hung +1 more | 2019-04-23 |
| 10269768 | Stacked integrated circuits with redistribution lines | Cheng-Ying Ho, Jeng-Shyan Lin, Wen-I Hsu, Feng-Chi Hung, Ying-Ling Tsai | 2019-04-23 |
| 10192918 | Image sensor including dual isolation and method of making the same | Jeng-Shyan Lin, Jen-Cheng Liu, Chun-Chieh Chuang, Volume Chien | 2019-01-29 |
| 10177186 | Pixel structure of image sensor and method of forming same | Tzu-Jui Wang, Keng-Yu Chou, Chun-Hao Chuang, Ming-Chieh Hsu, Ren-Jie Lin +1 more | 2019-01-08 |