CC

Chun-Wen Cheng

TSMC: 240 patents #51 of 12,232Top 1%
UM United Microelectronics: 3 patents #1,523 of 4,560Top 35%
CC Chi Lin Technology Co.: 1 patents #15 of 56Top 30%
📍 Dashulong, TW: #7 of 596 inventorsTop 2%
Overall (All Time): #2,101 of 4,157,543Top 1%
244
Patents All Time

Issued Patents All Time

Showing 76–100 of 244 patents

Patent #TitleCo-InventorsDate
10508345 Sensor in an internet-of-things and manufacturing method of the same Ming-Ta Lei, Chia-Hua Chu, Hsin-Chih Chiang, Tung-Tsun Chen 2019-12-17
10508023 MEMS devices including MEMS dies and connectors thereto Jung-Huei Peng, Shang-Ying Tsai, Hung-Chia Tsai, Yi-Chuan Teng 2019-12-17
10508029 MEMS integrated pressure sensor devices and methods of forming same Chia-Hua Chu 2019-12-17
10494252 MEMS devices and methods of manufacturing the same Yu-Chia Liu, Chia-Hua Chu 2019-12-03
10486964 Method for forming a micro-electro mechanical system (MEMS) including bonding a MEMS substrate to a CMOS substrate via a blocking layer Chia-Hua Chu 2019-11-26
10473616 Backside CMOS compatible BioFET with no plasma induced damage Yi-Shao Liu, Chun-Ren Cheng, Ching-Ray Chen, Yi-Hsien Chang, Fei-Lung Lai 2019-11-12
10472233 Method for integrating complementary metal-oxide-semiconductor (CMOS) devices with microelectromechanical systems (MEMS) devices using a flat surface above a sacrificial layer Chia-Hua Chu 2019-11-12
10429341 Method of using integrated electro-microfluidic probe card Yi-Shao Liu, Fei-Lung Lai, Chun-Ren Cheng 2019-10-01
10384933 Method of forming micro electromechanical system sensor Hung-Chia Tsai, Lan-Lin Chao, Yuan-Chih Hsieh, Ping-Yin Liu 2019-08-20
10351417 MEMS device with viewer window and manufacturing method thereof Chi-Hang Chin, Jung-Huei Peng, Chia-Hua Chu, Shang-Ying Tsai 2019-07-16
10273148 Micro-electro-mechanical system and manufacturing method thereof Jung-Huei Peng, Chia-Hua Chu, Nien-Tsung Tsai, Yao-Te Huang, Li-Min Hung +1 more 2019-04-30
10273144 Multi-pressure MEMS package Yu-Chia Liu, Chia-Hua Chu, Kuei-Sung Chang, Jung-Huei Peng 2019-04-30
10266396 MEMS device with enhanced sensing structure and manufacturing method thereof Ching-Kai Shen, Wen-Chuan Tai, Chia-Ming Hung, Hsiang-Fu Chen, Jung-Huei Peng 2019-04-23
10202278 Semiconductor structure with cavity spacing monitoring functions Jung-Huei Peng, Yi-Chien Wu, Yu-Chia Liu 2019-02-12
10184912 Backside sensing BioFET with enhanced performance Yi-Shao Liu, Fei-Lung Lai, Wei-Cheng Lin, Ta-Chuan Liao, Chien-Kuo Yang 2019-01-22
10160638 Method and apparatus for a semiconductor structure Li-Cheng Chu, Ping-Yin Liu, Xin-Hua Huang, Yuan-Chih Hsieh, Lan-Lin Chao 2018-12-25
10160633 MEMS devices and fabrication methods thereof Chia-Hua Chu, Te-Hao Lee, Chung-Hsien Lin 2018-12-25
10160639 Semiconductor structure for MEMS Device Yu-Chia Liu, Chia-Hua Chu, Jung-Huei Peng 2018-12-25
10160640 Mechanisms for forming micro-electro mechanical system device Chia-Hua Chu 2018-12-25
10155659 Vacuum sealed MEMS and CMOS package Yi-Chuan Teng, Hung-Chia Tsai, Chia-Hua Chu 2018-12-18
10155655 MEMS devices and fabrication methods thereof Chia-Hua Chu, Te-Hao Lee, Chung-Hsien Lin 2018-12-18
10155244 Fluid deposition appartus and method Jung-Huei Peng, Yi-Shao Liu, Fei-Lung Lai, Shang-Ying Tsai 2018-12-18
10155214 Getter, MEMS device and method of forming the same Chin-Wei Liang, Cheng-Yuan Tsai, Chia-Shiung Tsai 2018-12-18
10145847 Method for forming biochips and biochips with non-organic landings for improved thermal budget Chia-Hua Chu, Allen Timothy Chang, Ching-Ray Chen, Yi-Hsien Chang, Yi-Shao Liu +1 more 2018-12-04
10138116 Method for integrating complementary metal-oxide-semiconductor (CMOS) devices with microelectromechanical systems (MEMS) devices using a flat surface above a sacrificial layer Chia-Hua Chu 2018-11-27