Issued Patents All Time
Showing 101–125 of 244 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10134552 | Method for fabricating MEMS switch with reduced dielectric charging effect | Chia-Hua Chu, Chung-Hsien Lin | 2018-11-20 |
| 10101292 | MEMS humidity sensor and method of manufacturing the same | Tung-Tsun Chen, Chia-Hua Chu, Jui-Cheng Huang, Cheng-Hsiang Hsieh | 2018-10-16 |
| 10094801 | Amplified dual-gate bio field effect transistor | Yi-Shao Liu, Rashid Bashir, Fei-Lung Lai | 2018-10-09 |
| 10065852 | MEMS device and manufacturing method thereof | Chia-Hua Chu, MING-DAO WU, Tzu-Heng Wu | 2018-09-04 |
| 10035700 | Semiconductor structure and manufacturing method thereof | Chia-Hua Chu, Fei-Lung Lai, Shiang-Chi Lin | 2018-07-31 |
| 10017382 | MEMS integrated pressure sensor devices and methods of forming same | Chia-Hua Chu | 2018-07-10 |
| 10017378 | MEMS pressure sensor and microphone devices having through-vias and methods of forming same | Chia-Hua Chu | 2018-07-10 |
| 9998843 | Method for manufacturing a microphone | Jung-Huei Peng, Chia-Hua Chu, Chin-Yi Cho, Li-Min Hung, Yao-Te Huang | 2018-06-12 |
| 9981841 | MEMS integrated pressure sensor and microphone devices and methods of forming same | Chia-Hua Chu | 2018-05-29 |
| 9976982 | Backside sensing BioFET with enhanced performance | Yi-Shao Liu, Fei-Lung Lai, Wei-Cheng Lin, Ta-Chuan Liao, Chien-Kuo Yang | 2018-05-22 |
| 9975762 | Stacked semiconductor structure and method of forming the same | Chia-Hua Chu | 2018-05-22 |
| 9938138 | MEMS device structure with a capping structure | Chia-Hua Chu | 2018-04-10 |
| 9933388 | Integrated biosensor | Fei-Lung Lai, Chia-Hua Chu, Yi-Hsien Chang, Hsin-Chieh Huang | 2018-04-03 |
| 9919914 | MEMS devices including MEMS dies and connectors thereto | Jung-Huei Peng, Shang-Ying Tsai, Hung-Chia Tsai, Yi-Chuan Teng | 2018-03-20 |
| 9915630 | Biochip with biosensors and fluidic devices | Yi-Shao Liu, Chun-Ren Cheng | 2018-03-13 |
| 9910009 | CMOS compatible BioFET | Alexander Kalnitsky, Yi-Shao Liu, Kai-Chih Liang, Chia-Hua Chu, Chun-Ren Cheng | 2018-03-06 |
| 9873610 | Multiple bonding in wafer level packaging | Chung-Hsien Lin, Chia-Hua Chu, Li-Cheng Chu, Yuan-Chih Hsieh | 2018-01-23 |
| 9868628 | Method and structure for CMOS-MEMS thin film encapsulation | Yu-Chia Liu, Chia-Hua Chu | 2018-01-16 |
| 9850125 | MEMS integrated pressure sensor devices having isotropic cavitites and methods of forming same | Chia-Hua Chu | 2017-12-26 |
| 9822000 | MEMS and CMOS integration with low-temperature bonding | Chia-Hua Chu, Jung-Huei Peng | 2017-11-21 |
| 9815685 | Semiconductor sensing structure and manufacturing method thereof | Yi-Hsien Chang, Chun-Ren Cheng, Shih-Wei Lin, Wei-Cheng Shen | 2017-11-14 |
| 9797976 | Biosensor calibration system and related method | Chin-Hua Wen, Jui-Cheng Huang, Yi-Shao Liu, Tung-Tsun Chen | 2017-10-24 |
| 9796582 | Method for integrating complementary metal-oxide-semiconductor (CMOS) devices with microelectromechanical systems (MEMS) devices using a flat surface above a sacrificial layer | Chia-Hua Chu | 2017-10-24 |
| 9791406 | CMOS compatible BioFET | Alexander Kalnitsky, Yi-Shao Liu, Kai-Chih Liang, Chia-Hua Chu, Chun-Ren Cheng | 2017-10-17 |
| 9776856 | Vacuum sealed MEMS and CMOS package | Yi-Chuan Teng, Hung-Chia Tsai, Chia-Hua Chu | 2017-10-03 |