Issued Patents All Time
Showing 51–75 of 219 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11735576 | Integrated circuit package and method | Chen-Hua Yu, Chung-Hao Tsai | 2023-08-22 |
| 11728327 | Integrated circuit package and method | Chen-Hua Yu, Chung-Hao Tsai | 2023-08-15 |
| 11682583 | Through-vias and methods of forming the same | Chung-Hao Tsai, En-Hsiang Yeh | 2023-06-20 |
| 11676906 | Chip package and manufacturing method thereof | Chen-Hua Yu | 2023-06-13 |
| 11646313 | Semiconductor and circuit structures, and related methods | Chang-Fen Hu, Shao-Yu Li, Kuo-Ji Chen, Chih-Peng Lin, Ching-Fang Chen | 2023-05-09 |
| 11637097 | Method of manufacturing package structure | Shih-Ya Huang, Chung-Hao Tsai, Chen-Hua Yu | 2023-04-25 |
| 11631658 | Under-bump-metallization structure and redistribution layer design for integrated fan-out package with integrated passive device | Yu-Chih Huang, Chi-Hui Lai, Ban-Li Wu, Ying-Cheng Tseng, Ting-Ting Kuo +5 more | 2023-04-18 |
| 11621244 | Integrated circuit package and method | Chen-Hua Yu, Chieh-Yen Chen, Wei Ling Chang | 2023-04-04 |
| 11605622 | Photonic semiconductor device and method | Chih-Chieh Chang, Chung-Hao Tsai, Hsing-Kuo Hsia, Chen-Hua Yu | 2023-03-14 |
| 11600431 | InFO coil on metal plate with slot | Wei-Ting Chen, Chieh-Yen Chen, Hao-Yi Tsai, Ming Hung Tseng, Hung-Yi Kuo +1 more | 2023-03-07 |
| 11587916 | Package structure and manufacturing method thereof | Chung-Hao Tsai, Chen-Hua Yu, Tzu-Chun Tang | 2023-02-21 |
| 11562926 | Package structure and method of forming thereof | Chih-Lin Chen, Chung-Hao Tsai, Jeng-Shien Hsieh, Chen-Hua Yu, Chih-Yuan Chang | 2023-01-24 |
| 11532533 | Integrated circuit package and method | Chen-Hua Yu, Wei Ling Chang, Fong-Yuan Chang, Chieh-Yen Chen | 2022-12-20 |
| 11532565 | System on integrated chips and methods of forming the same | Chen-Hua Yu | 2022-12-20 |
| 11532868 | Antenna apparatus and method | Lai Wei Chih, Monsen Liu, En-Hsiang Yeh, Chen-Hua Yu | 2022-12-20 |
| 11527486 | Semiconductor device with shield for electromagnetic interference | Chen-Hua Yu, Wei-Ting Chen, Chieh-Yen Chen | 2022-12-13 |
| 11495573 | Package structure and manufacturing method thereof | Chung-Hao Tsai, Chen-Hua Yu | 2022-11-08 |
| 11488909 | Package structure | Chun-Wen Lin, Chung-Hao Tsai, Chen-Hua Yu, Che-Wei Hsu | 2022-11-01 |
| 11482788 | Antenna device and method for manufacturing antenna device | Chung-Hao Tsai, Jeng-Shien Hsieh, Wei-Heng Lin, Kuo-Chung Yee, Chen-Hua Yu | 2022-10-25 |
| 11460633 | Semiconductor package and manufacturing method thereof | Chih-Chieh Chang, Chung-Hao Tsai, Chen-Hua Yu | 2022-10-04 |
| 11456249 | Package structure, package-on-package structure and manufacturing method thereof | Tin-Hao Kuo | 2022-09-27 |
| 11456251 | Semiconductor structure, package structure, and manufacturing method thereof | Wei-Ting Chen, Chung-Hao Tsai, Chen-Hua Yu | 2022-09-27 |
| 11450628 | Package structure including a solenoid inductor laterally aside a die and method of fabricating the same | Tzu-Chun Tang, Chung-Hao Tsai, Chen-Hua Yu, Chia-Chia Lin | 2022-09-20 |
| 11424197 | Package, package structure with redistributing circuits and antenna elements and method of manufacturing the same | Chung-Hao Tsai, Chen-Hua Yu, Chun-Lin Lu, Han-Ping Pu, Kai-Chiang Wu | 2022-08-23 |
| 11417698 | Semiconductor package and method of forming the same | Chia-Lun Chang, Ching-Hua Hsieh, Chung-Hao Tsai, Chung-Shi Liu, Hsiu-Jen Lin | 2022-08-16 |