Issued Patents All Time
Showing 76–100 of 219 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11410923 | Semiconductor device, integrated fan-out package and method of forming the same | Chung-Hao Tsai, Chen-Hua Yu, Wei-Ting Chen | 2022-08-09 |
| 11404316 | System, device and methods of manufacture | Chen-Hua Yu, Wei Ling Chang, Tin-Hao Kuo, Che-Wei Hsu | 2022-08-02 |
| 11398440 | Polymer layers embedded with metal pads for heat dissipation | Hao-Hsiang Chuang, Shih-Wei Liang, Ching-Feng Yang, Kai-Chiang Wu, Hao-Yi Tsai +1 more | 2022-07-26 |
| 11387222 | Integrated circuit package and method | Chen-Hua Yu, Wei Ling Chang, Chieh-Yen Chen | 2022-07-12 |
| 11380655 | Die stacks and methods forming same | Chen-Hua Yu, Chung-Hao Tsai | 2022-07-05 |
| 11362077 | Photonic semiconductor device and method | Chih-Chieh Chang, Chung-Hao Tsai, Hsing-Kuo Hsia, Chen-Hua Yu | 2022-06-14 |
| 11348886 | Integrated fan-out package | Tzu-Chun Tang, Chieh-Yen Chen, Che-Wei Hsu | 2022-05-31 |
| 11335767 | Package structure and method of fabricating the same | Chen-Hua Yu, Tzu-Chun Tang, Wei-Ting Chen, Chieh-Yen Chen | 2022-05-17 |
| 11322470 | Optical semiconductor package and method for manufacturing the same | Chih-Chieh Chang, Yu-Kuang Liao, Hsing-Kuo Hsia, Chih-Yuan Chang, Jeng-Shien Hsieh +1 more | 2022-05-03 |
| 11315891 | Methods of forming semiconductor packages having a die with an encapsulant | Chung-Hao Tsai, Chia-Chia Lin, Kai-Chiang Wu, Chen-Hua Yu | 2022-04-26 |
| 11302649 | Semiconductor device with shielding structure for cross-talk reduction | Shih-Ya Huang, Chung-Hao Tsai, Chen-Hua Yu, Chih-Yuan Chang | 2022-04-12 |
| 11289449 | Packaging methods for semiconductor devices, packaged semiconductor devices, and design methods thereof | Monsen Liu, Chen-Hua Yu | 2022-03-29 |
| 11282816 | Memory packages and methods of forming same | Chen-Hua Yu, Chung-Hao Tsai, Yih Wang | 2022-03-22 |
| 11282810 | Integrated fan-out package and manufacturing method thereof | Albert Wan, Ching-Hua Hsieh, Chung-Hao Tsai, Chao-Wen Shih, Han-Ping Pu +5 more | 2022-03-22 |
| 11264316 | Package structure and method of manufacturing the same | Chun-Lin Lu, Kai-Chiang Wu | 2022-03-01 |
| 11244939 | Package structure and method of forming the same | Chung-Hao Tsai, Chen-Hua Yu, Wei-Ting Chen | 2022-02-08 |
| 11244896 | Package structure and manufacturing method thereof | Min-Chien Hsiao, Chao-Wen Shih, Han-Ping Pu, Chieh-Yen Chen | 2022-02-08 |
| 11239157 | Package structure and package-on-package structure | Chung-Hao Tsai, Chen-Hua Yu, Wei-Ting Chen | 2022-02-01 |
| 11222883 | Package structure and method of manufacturing the same | Shih-Ya Huang, Chung-Hao Tsai, Chen-Hua Yu | 2022-01-11 |
| 11211371 | Integrated circuit package and method | Chen-Hua Yu, Wei Ling Chang, Chieh-Yen Chen | 2021-12-28 |
| 11211339 | Semiconductor device | Vincent Chen, Tzu-Chun Tang, Chen-Hua Yu, Ching-Feng Yang, Ming-Kai Liu +5 more | 2021-12-28 |
| 11211358 | Packaged semiconductor devices and packaging methods | Tzu-Chun Tang, Chun-Lin Lu, Wei-Ting Chen, Vincent Chen, Shou-Zen Chang +1 more | 2021-12-28 |
| 11211360 | Passive device module, semiconductor package including the same, and manufacturing method thereof | Shih-Ya Huang, Chung-Hao Tsai, Chen-Hua Yu | 2021-12-28 |
| 11195817 | Semiconductor package and manufacturing method thereof | Shih-Ya Huang, Chung-Hao Tsai, Chen-Hua Yu, Chih-Yuan Chang | 2021-12-07 |
| 11171088 | Electronic apparatus including antennas and directors | Tzu-Chun Tang, Chung-Hao Tsai, Chen-Hua Yu, Che-Wei Hsu | 2021-11-09 |