Issued Patents All Time
Showing 101–125 of 219 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11139206 | Semiconductor device with conductive shielding structure | Chen-Hua Yu | 2021-10-05 |
| 11094682 | Package structure and method of fabricating the same | Rabiul Islam, Stefan Rusu, Weiwei Song | 2021-08-17 |
| 11094671 | Package with thinned substrate | Chen-Hua Yu, Chung-Hao Tsai | 2021-08-17 |
| 11094634 | Semiconductor package structure comprising rigid-flexible substrate and manufacturing method thereof | Chen-Hua Yu, Chung-Shi Liu, Chih-Yuan Chang, Jiun Yi Wu, Jeng-Shien Hsieh +1 more | 2021-08-17 |
| 11075136 | Heat transfer structures and methods for IC packages | Ying-Chih Hsu, Alan Roth, Chih-Yuan Chang, Eric Soenen, Chih-Lin Chen | 2021-07-27 |
| 11063016 | Integrated fan-out package including voltage regulators and methods forming same | Chen-Hua Yu, Chih-Yuan Chang, Jeng-Shien Hsieh | 2021-07-13 |
| 11062998 | Semiconductor package and manufacturing method thereof | Chung-Hao Tsai, Chen-Hua Yu, Wei-Ting Chen, Chien-Hsun Chen, Shih-Ya Huang | 2021-07-13 |
| 11050153 | Encapsulating low-k dielectric blocks along with dies in an encapsulant to form antennas | Monsen Liu, Lai Wei Chih, Chung-Hao Tsai, Jeng-Shien Hsieh, En-Hsiang Yeh | 2021-06-29 |
| 11011460 | Package structure, package-on-package structure and manufacturing method thereof | Tin-Hao Kuo | 2021-05-18 |
| 11004811 | Semiconductor structure | Vincent Chen, Hung-Yi Kuo, Hao-Yi Tsai, Chen-Hua Yu, Wei-Ting Chen +2 more | 2021-05-11 |
| 10996410 | Methods of forming semiconductor packages | Jeng-Shien Hsieh, Hsing-Kuo Hsia, Chen-Hua Yu | 2021-05-04 |
| 10978781 | 3D antenna for integrated circuits | Jeng-Shien Hsieh, Chung-Hao Tsai, Chen-Hua Yu | 2021-04-13 |
| 10962711 | Semiconductor package and manufacturing method thereof | Chih-Chieh Chang, Chung-Hao Tsai, Chen-Hua Yu | 2021-03-30 |
| 10950553 | System on integrated chips and methods of forming the same | Chen-Hua Yu | 2021-03-16 |
| 10930628 | Photonic semiconductor device and method | Chih-Chieh Chang, Chung-Hao Tsai, Hsing-Kuo Hsia, Chen-Hua Yu | 2021-02-23 |
| 10879183 | Semiconductor device and method of manufacture | Chung-Hao Tsai, Chen-Hua Yu | 2020-12-29 |
| 10872878 | Packaging methods for semiconductor devices, packaged semiconductor devices, and design methods thereof | Monsen Liu, Chen-Hua Yu | 2020-12-22 |
| 10867938 | Package structure | Tzu-Chun Tang, Chung-Hao Tsai, Chen-Hua Yu | 2020-12-15 |
| 10867936 | Semiconductor device with shield for electromagnetic interference | Chen-Hua Yu, Wei-Ting Chen, Chieh-Yen Chen | 2020-12-15 |
| 10847304 | InFO coil on metal plate with slot | Wei-Ting Chen, Chieh-Yen Chen, Hao-Yi Tsai, Ming Hung Tseng, Hung-Yi Kuo +1 more | 2020-11-24 |
| 10840227 | Under-bump-metallization structure and redistribution layer design for integrated fan-out package with integrated passive device | Yu-Chih Huang, Chi-Hui Lai, Ban-Li Wu, Ying-Cheng Tseng, Ting-Ting Kuo +5 more | 2020-11-17 |
| 10825602 | Stacked coil for wireless charging structure on InFO package | Chen-Hua Yu, Tzu-Chun Tang, Hao-Yi Tsai, Ming Hung Tseng, Chieh-Yen Chen +1 more | 2020-11-03 |
| 10818640 | Die stacks and methods forming same | Chen-Hua Yu, Chung-Hao Tsai | 2020-10-27 |
| 10811404 | Package structure and method of manufacturing the same | Shih-Ya Huang, Chung-Hao Tsai, Chen-Hua Yu | 2020-10-20 |
| 10804953 | Method of using integrated transmitter and receiver front end module | En-Hsiang Yeh, Monsen Liu | 2020-10-13 |